CuClad 217 both layer Copper Clad Laminate with 0.25mm, 0.51mm, 0.79mm, 1.57mm substrate for Demanding RF/Microwave Circuits

CuClad 217 Copper Clad Laminate: The Pinnacle of Low-Loss, Isotropic Performance for Demanding RF/Microwave Circuits

As your dedicated supplier for precision high-frequency materials, we introduce the CuClad 217 laminate—a premier PTFE/woven fiberglass composite engineered to deliver uncompromising electrical performance for the most critical microwave and defense applications. This material sets the benchmark for ultra-low loss and true electrical isotropy in the circuit plane.

Unmatched Electrical Performance for Critical Signals

CuClad 217 is distinguished by its exceptional electrical properties, achieved through a specialized formulation with a high PTFE-to-glass ratio. It offers the lowest dielectric constant (Dk of 2.17/2.20 @ 10 GHz) and the lowest dissipation factor (Df of 0.0009 @ 10 GHz) available in fiberglass-reinforced PTFE laminates. This ultra-low loss is paramount for applications requiring maximum signal integrity, faster signal propagation, and superior signal-to-noise ratios, such as in low-noise amplifiers (LNAs), filters, and sensitive radar receivers.

Its most significant advantage is true electrical and mechanical isotropy in the X-Y plane, a unique claim in the industry. This is achieved through a cross-piled woven fiberglass construction where alternating plies are oriented 90 degrees to each other. This ensures that the dielectric constant and circuit performance remain consistent regardless of the signal's direction or the component's orientation on the board. This characteristic is absolutely critical for the precision required in phased array antenna systems and other Er-sensitive circuits.

CuClad 217 Data​ Sheet

Robust and Reliable Construction for Harsh Environments

Designed for reliability in demanding military and aerospace environments, CuClad 217 provides excellent mechanical stability. It features a very low and balanced CTE in the X and Y axes (29/28 ppm/°C), promoting outstanding dimensional stability and plated through-hole reliability during thermal cycling. The material exhibits high copper peel strength (14 lbs/in) after thermal stress, ensuring durable interconnects.

Furthermore, CuClad 217 meets UL94 V-0 flammability standards and demonstrates extremely low outgassing (0.01% TML), making it suitable for space-constrained and vacuum environments. Its very low water absorption (0.02%) ensures stable performance in humid conditions.

Key Features and Benefits for RF Designers and Fabricators:

Industry-Leading Low Loss: Df of 0.0009 minimizes signal attenuation for high-efficiency designs.

True X-Y Isotropy: Enables predictable performance for circuits in any orientation, simplifying design for phased arrays.

Excellent Thermal & Dimensional Stability: Low, matched CTE ensures reliability under thermal stress.

Proven Durability: High peel strength and robust mechanical properties suit harsh environment applications.

Standard & Custom Formats: Available in common copper weights (½, 1, 2 oz. ED copper) and panel sizes (e.g., 36" x 36", 36" x 48").

Typical Applications:

Phased Array and Defense Radar Systems

Electronic Warfare (ECM/ESM) & Military Communications

Critical Microwave Components (LNAs, Filters, Couplers)

Satellite Communications & Aerospace Electronics

For your most performance-driven RF and microwave PCB projects where signal loss and directional consistency cannot be compromised, CuClad 217 is the definitive material choice. Contact our technical sales team to discuss your specific requirements, explore the availability of "LX" tested-grade material for critical applications, or to request a quote. We provide the foundational materials that enable next-generation electronic performance.