Manufacture F4BTMS220 circuit boards use PTFE material High-Frequency Double sided copper laminate for RF Applications

F4BTMS220 Ultra-Low Loss PTFE Laminate: High-Frequency Performance for Demanding Aerospace & RF Applications

As your specialized supplier of advanced high-frequency circuit materials, we proudly introduce the F4BTMS220 copper clad laminate from Taizhou Wangling. This state-of-the-art PTFE composite is engineered for the most demanding aerospace, military, and high-frequency commercial applications, offering an exceptional combination of ultra-low loss, remarkable stability, and high reliability.

Unmatched Electrical Performance and Stability

The F4BTMS220 is designed to deliver superior signal integrity. Its core electrical properties include a low dielectric constant (Dk) of 2.2 with an exceptionally tight tolerance of ±0.02 and an ultra-low dissipation factor (Df) of 0.0009 at 10 GHz. This ultra-low loss is critical for minimizing signal attenuation, enabling high-efficiency designs for sensitive RF and microwave circuits.

A key advantage of the F4BTMS220 is its outstanding stability. The material exhibits excellent frequency stability, maintaining consistent Dk and Df values from 0.5 GHz up to 40 GHz. It also features superior temperature stability, with a low dielectric constant temperature coefficient (TCDk) of approximately -130 ppm/°C across an operational range of -55°C to +150°C. This ensures predictable performance in environments with extreme temperature fluctuations, making it ideal for phase-sensitive applications like phased array antennas and satellite communications.

F4BTMS220 Data sheet

Advanced Material Composition for Superior Reliability

This laminate represents a technological advancement over traditional PTFE materials. It utilizes an ultra-thin, ultra-fine glass fiber fabric reinforcement combined with a high loading of specialized nano-ceramic fillers within the PTFE resin matrix. This proprietary formulation significantly reduces the "fiber weave effect," minimizes anisotropy in the X, Y, and Z directions, and enhances overall dimensional stability and thermal conductivity.

The material is supplied standard with RTF (Reverse Treat Foil) low-profile copper, which reduces conductor loss at high frequencies while providing excellent peel strength (>2.4 N/mm). It is fully compatible with standard PTFE PCB fabrication processes and is well-suited for complex multi-layer boards, dense via designs, and fine-line circuitry.

Key Features and Benefits for High-Reliability PCB Fabrication:

Ultra-Low & Stable Loss: Df as low as 0.0009 ensures maximum signal integrity for high-frequency designs.

Exceptional Environmental Stability: Stable performance across wide frequency (up to 40 GHz) and temperature ranges (-55°C to +260°C).

High Reliability: Features low moisture absorption (0.02%), excellent thermal stress resistance (passes 260°C solder float), and meets UL94 V-0 flammability rating.

Space-Qualified: Exhibits low outgassing properties suitable for vacuum environments and offers excellent radiation resistance.

Design Flexibility: Available in standard panel sizes (e.g., 460x610mm) and a wide range of thin and thick dielectrics (from 0.09mm). Options for aluminum or copper backing (F4BTMS220-AL/CU) are available for thermal management or shielding.

Typical Applications:

Aerospace & Satellite Communication Systems

Phased Array and Phase-Sensitive Antennas

Radar and Military Radar Systems

High-Frequency RF/Microwave Components and Feed Networks

For your next high-performance PCB project where signal loss, phase stability, and reliability under extreme conditions are non-negotiable, the F4BTMS220 laminate is the premier domestic solution capable of replacing imported alternatives. Contact our technical sales team to discuss your specific requirements, request samples, or obtain a quotation. We are committed to providing the material foundation for your most critical electronic systems.