F4BME294 High-Frequency double sided Copper Clad Laminate 0.5mm, 0.762mm, 1.0mm, 1.524mm substrate for RF microwave PCB

F4BME294 High-Performance Copper Clad Laminate Description

The F4BME294 is an advanced, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate engineered for high-frequency applications that require a near-unity dielectric constant for optimal circuit miniaturization, combined with low signal loss and superior PIM performance. Part of the premium "E" series from Taizhou Wangling Insulation Material Factory, this material utilizes a specialized low-profile copper foil to meet the stringent demands of modern microwave and RF systems, offering a high-performance alternative to imported equivalents.

Product Composition and Technology
The laminate is constructed from a precisely formulated composite of woven glass fiber cloth and PTFE resin, with an increased proportion of glass fiber to achieve its elevated and stable dielectric constant. The core differentiator of the F4BME series is its lamination with reverse-treated foil (RTF) copper. This foil type is critical for the F4BME294's performance, delivering exceptional Passive Intermodulation (PIM) characteristics (≤-159 dBc), enabling ultra-precise etching for fine-line circuits, and minimizing conductor loss at millimeter-wave frequencies.

F4BME294 Data Sheet

Electrical Performance Specifications

Dielectric Constant (Dk): A nominal value of 2.94 at 10 GHz, with a tolerance of ±0.06. This value allows for significant miniaturization of circuit elements while maintaining excellent electrical field containment.

Dissipation Factor (Df): Features a low loss tangent of 0.0016 at 10 GHz and 0.0023 at 20 GHz, ensuring minimal signal attenuation in compact, high-frequency circuits.

Dielectric Constant Temperature Coefficient (TcDk): -85 ppm/°C over the range of -55°C to +150°C. This stable thermal coefficient ensures predictable performance across wide temperature variations, critical for aerospace and outdoor applications.

Standard Physical and Performance Specifications

Copper Foil: Standard configuration uses 1 oz (0.035mm) Reverse Treated Foil (RTF). A 0.5 oz (0.018mm) RTF option is also available for finer line applications.

Available Thickness: Offered in a wide range of total or dielectric-only thicknesses. For the F4BME294 (Dk 2.7-3.0), the minimum achievable dielectric core thickness is 0.2mm. Standard thickness options include 0.5mm, 0.762mm, 1.0mm, 1.524mm, etc., each with defined manufacturing tolerances (e.g., 1.0mm ±0.05mm).

Standard Panel Sizes: Commercially efficient sizes include 460mm x 610mm, 500mm x 600mm, 850mm x 1200mm, and 914mm x 1220mm. Custom panel dimensions are available for volume orders.

Mechanical and Thermal Characteristics:

Peel Strength: >1.6 N/mm (with 1 oz RTF copper), ensuring reliable copper adhesion during assembly.

Coefficient of Thermal Expansion (CTE): XY-direction: 12-15 ppm/°C; Z-direction: 98 ppm/°C (-55°C to 288°C). The high glass content delivers exceptional dimensional stability.

Thermal Conductivity (Z-direction): 0.41 W/(m·K), providing improved heat dissipation compared to lower-Dk variants.

Operating Temperature Range: -55°C to +260°C.

Flammability Rating: UL 94 V-0.

Additional Critical Properties:

Insulation Resistance: Volume resistivity ≥6x10⁶ MΩ·cm; surface resistivity ≥1x10⁶ MΩ.

Moisture Absorption: ≤0.08%, ensuring stable performance in humid environments.

Process Reliability: Passes thermal stress test (260°C solder dip, 10 seconds, 3 cycles) without delamination.

Electrical Strength: >30 kV/mm (Z-direction) and >36 kV breakdown voltage (XY-direction).

Primary Application Areas

Miniaturized Phase Shifters and Attenuators

High-Density Antenna Feed Networks and Phased Array Elements

Compact Filters, Diplexers, and Multiplexers for Base Stations and Satellite Payloads

Millimeter-Wave Communication Modules

Low-PIM Components for High-Sensitivity Receivers

In summary, the F4BME294 copper clad laminate is a high-end material solution that provides a stable dielectric constant near 3.0, excellent low-loss characteristics, and guaranteed ultra-low PIM performance. Its superior dimensional stability, enhanced thermal properties, and robust construction make it an optimal choice for designers pushing the limits of miniaturization and performance in next-generation wireless, aerospace, and defense electronics.