Rogers RO4730G3 PCB 20mil Substrate laminate 1oz copper weight on both layer with ENEPIG Finish

RO4730G3 PCB 20mil Substrate with ENEPIG Finish

The RO4730G3 PCB is a high-performance, custom-designed circuit board tailored for advanced RF and microwave applications. Built on Rogers RO4730G3 hydrocarbon/ceramic laminate, this PCB offers a powerful combination of low dielectric loss, exceptional thermal stability, and ease of manufacturability. The 20mil substrate, combined with 1oz (35μm) copper weight and ENEPIG surface finish, ensures optimal electrical performance, durability, and compatibility with high-frequency designs.

With its 2-layer rigid construction, compact dimensions, and precise tolerances, this PCB is ideally suited for demanding applications such as cellular base station antennas and other RF systems that require consistent performance and reliability. Designed to meet IPC-Class-2 standards, it undergoes 100% electrical testing to guarantee quality before shipment.

Key PCB Construction Details

The table below summarizes the primary construction specifications of the RO4730G3 PCB:

PCB Stackup

The RO4730G3 PCB features a simple but effective stackup designed to ensure optimal signal integrity and thermal performance:

• Copper Layer 1: 35μm (1oz) for high conductivity and signal transmission.
• Core Layer: 0.508mm (20mil) Rogers RO4730G3, a hydrocarbon/ceramic composite providing low dielectric loss and high mechanical stability.
• Copper Layer 2: 35μm (1oz) for consistent grounding and signal performance.

Understanding Rogers RO4730G3 Laminate

The RO4730G3 laminate is an advanced material designed specifically for high-frequency and antenna-grade applications. This hydrocarbon/ceramic/woven glass composite delivers a range of performance benefits:

Low Dielectric Loss: The Dk of 3.0 ± 0.05 at 10GHz ensures excellent signal propagation with minimal loss.

The dissipation factor of 0.0028 makes it ideal for high-frequency designs.

Thermal Stability: With a Tg >280°C and a decomposition temperature (Td) of 411°C, the laminate performs reliably in high-temperature environments. Its low Z-axis CTE (<30 ppm/°C) reduces the risk of failure in plated through-holes (PTHs).

Ease of Fabrication: Unlike traditional PTFE-based laminates, RO4730G3 is compatible with conventional FR-4 manufacturing processes, eliminating the need for special treatments during PTH preparation.

Lightweight Construction: RO4730G3 is 30% lighter than PTFE/glass laminates, making it an excellent choice for weight-sensitive applications like cellular base station antennas.

Environmentally Friendly: The laminate is compatible with lead-free soldering processes and complies with RoHS standards.

Applications

The RO4730G3 PCB is designed for a variety of advanced RF and microwave applications, including:

• Cellular Base Station Antennas
• Microwave and RF Systems
• Other Applications

Benefits of RO4730G3 PCB

The low dielectric constant (Dk) and dissipation factor enable consistent circuit performance at high frequencies.

High Tg and low Z-axis CTE ensure durability under thermal stress and mechanical stability during operation.

The compatibility with FR-4 manufacturing processes reduces production costs compared to traditional PTFE laminates.

RoHS compliance and lead-free compatibility make the PCB environmentally friendly.

Conclusion

The RO4730G3 PCB 20mil Substrate with ENEPIG Finish is a high-performance solution for RF and microwave applications. Its advanced construction, low dielectric loss, and thermal stability make it an ideal choice for industries requiring precision, reliability, and cost-efficiency. From cellular base station antennas to other high-frequency systems, this PCB delivers exceptional performance while meeting the demands of modern electronics manufacturing.