4-layer PCB built on 5mil MT77+MT77 1078 Prepreg 0.6mm finished thickness with 0.25mm via, resin filled and capped

Key Features of the 4-Layer PCB
 
This 4-layer PCB is designed for applications requiring precision, reliability, and compact design. It is built with MT77 substrate material and MT77 1078 Prepreg, which is known for its superior thermal and electrical performance. The board incorporates resin-filled and capped vias for enhanced reliability and functional integrity. With a finished thickness of 0.6mm, this PCB supports immersion silver plating, ensuring excellent surface conductivity and solderability.
 

 
Specifications

 

 
MT77 Board Material
MT77 is a high-performance laminate material designed for high-frequency and high-speed PCB applications. It is valued for its low dielectric constant (Dk), low dissipation factor (Df), and excellent thermal reliability, making it suitable for advanced electronic systems.
 
 
Key Properties of MT77:
 
Low Dielectric Constant (Dk):
Provides consistent impedance control for high-frequency signals.
 
Low Dissipation Factor (Df):
Reduces signal loss, ensuring reliable high-speed data transmission.
 
High Thermal Stability:
Withstands elevated temperatures during processing and operational use, ensuring durability.
 
Dimensional Stability:
Maintains size and shape even under thermal and mechanical stress, ensuring precision in multilayer designs.
 
Moisture Resistance:
Suitable for environments with high humidity, maintaining performance over extended periods.
 
MT77 is particularly well-suited for RF/microwave circuits, 5G communication systems, and other high-frequency applications.
 
 
What Are Resin-Filled Vias?
Resin-filled vias are plated-through holes (PTHs) in a PCB that are filled with a specialized resin material. The resin filling is then cured and capped with copper to create a flat, secure, and conductive via structure.
 
 
Advantages of Resin-Filled Vias:
 
Improved Reliability:
Prevents solder from flowing into the vias during assembly, reducing the risk of solder voids and ensuring robust connections.
 
Enhanced Flatness:
The capped via surface provides a flat area for component placement, improving solder joint quality and assembly precision.
 
Prevention of Contamination:
Resin filling seals the vias, preventing contamination by moisture or debris.
 
Support for High-Density Designs:
Ideal for PCBs with tight spacing and high-density interconnects.
 
Applications of Resin-Filled Vias:

• HDI PCBs: Used in compact designs where via-in-pad or microvias are required.
• High-Frequency PCBs: Ensures signal reliability by reducing signal loss and interference.
• Power Electronics: Provides thermal and electrical isolation for high-current applications.

 
 
Benefits of Immersion Silver Plating
The immersion silver surface finish offers a flat, conductive, and solderable surface for PCB manufacturing. It is ideal for high-frequency and high-density applications due to its excellent electrical properties.
 
Key Benefits:
 
Immersion silver provides excellent electrical conductivity, making it suitable for high-frequency signals.
 
Ensures reliable assembly and solder joint quality, especially for fine-pitch components.
 
More affordable than gold finishes while offering comparable performance in many applications.
 
Lead-free and RoHS compliant.
 
 
Applications of This PCB
This 4-layer PCB is designed for applications that require compact, high-speed, and reliable performance. Its MT77 material, resin-filled vias, and immersion silver plating make it suitable for:
1. RF and Microwave Applications
Antennas and RF modules for advanced communication systems.
5G base stations and IoT devices.
 
2. High-Speed Digital Circuits
High-frequency data transmission circuits, such as routers and switches.
Signal processing and high-speed computing boards.
 
3. Consumer Electronics
Smartphones, tablets, and wearable devices requiring compact PCBs.
Advanced audio and video processing devices.
 
4. Automotive Electronics
Radar and sensor systems for ADAS (Advanced Driver Assistance Systems).
High-frequency communication modules for connected vehicles.
 
5. Aerospace and Defense
Advanced radar, navigation, and communication systems.
High-frequency signal processing for avionics.
 
 
Conclusion
This 4-layer PCB leverages the advanced properties of MT77 material, resin-filled vias, and immersion silver plating to deliver exceptional performance in high-frequency, high-speed, and compact applications. With its 0.6mm thickness, 0.25mm vias, and robust thermal and electrical characteristics, this PCB is a reliable choice for RF, automotive, consumer electronics, and telecommunications applications.