AL 5052 laminate Double-Layer Aluminum Substrate PCB with 2oz copper and HASL using in LED Lighting Power Electronics

Key Features of the Double-Layer Aluminum Substrate PCB

This double-layer PCB is specifically designed for applications requiring excellent thermal management and high performance. The PCB integrates 2W/MK aluminum substrate, ensuring efficient heat dissipation, and is built with 2oz finished copper. Its 3.2mm finished board thickness, combined with advanced materials and precise construction, makes it ideal for thermal and mechanical reliability.

Specifications

Why Use an Aluminum Substrate?

Aluminum substrates are widely used in PCBs for their thermal management properties, mechanical strength, and cost-effectiveness. The aluminum base is particularly well-suited for high-power or high-thermal applications, where traditional FR4 PCBs are insufficient.

Advantages of Aluminum Substrates:

Aluminum substrates effectively transfer heat away from heat-generating components, reducing thermal buildup and preventing system failures.

The 2 W/MK thermal conductivity ensures efficient heat transfer.

The AL 5052 alloy used in this PCB provides excellent mechanical stability, corrosion resistance, and high bending strength.

Aluminum is lighter and less expensive than other metals like copper while still providing high thermal conductivity.

Lower operating temperatures enhance the lifespan and performance of components and reduce failure rates due to overheating.

Key Technology for Heat Dissipation: Prepreg

The prepreg layer plays a critical role in managing heat within aluminum PCBs. It acts as a dielectric layer between the conductive copper and aluminum base, providing both electrical insulation and thermal conductivity.

Features of Prepreg in Aluminum PCBs:

The 120 μm dielectric thickness ensures efficient thermal transfer from the copper layer to the aluminum substrate while maintaining electrical insulation.

Prepreg materials with 2 W/MK thermal conductivity ensure minimal thermal resistance, allowing heat to dissipate quickly.

The prepreg layer provides high dielectric strength, maintaining electrical isolation between the copper circuitry and the aluminum core.

Prepreg securely bonds the copper layer to the aluminum substrate, ensuring mechanical stability during thermal cycling and operation.

Applications of Aluminum Substrate PCBs

Aluminum substrate PCBs are ideal for applications requiring efficient thermal management and high reliability, including:

1. LED Lighting

2. Power Electronics

3. Automotive Industry

4. Consumer Electronics

5. Renewable Energy

Conclusion

This double-layer aluminum substrate PCB combines the thermal efficiency of AL 5052, Lanbang W-8 solder mask, and Lanbang Thermasetting-08 component marking to deliver outstanding performance in high-power and heat-sensitive applications. The 2W/MK thermal conductivity, 3.2mm thickness, and lead-free HASL finish make this PCB an excellent choice for LED lighting, power electronics, and other industrial applications requiring reliable heat dissipation and durability.