F4BTMS615 Double-Layer 0.254mm substrate PCB with 1oz copper weight and Immersion Tin Finish using in Microwave, RF

F4BTMS615 Double-Layer 0.254mm PCB with Immersion Tin Finish
 
 
The F4BTMS615 Double-Layer PCB is a high-reliability circuit board designed for demanding aerospace, radar, and satellite communication applications. Built using F4BTMS615 laminate, this PCB features a 10mil (0.254mm) core enriched with nano-ceramics and reinforced with ultra-thin fiberglass. This unique construction provides low dielectric loss, excellent dimensional stability, and reduced anisotropy, making it ideal for high-frequency RF and microwave applications.
 

 
With a 0.3mm finished thickness and immersion tin surface finish, this PCB ensures exceptional solderability, excellent signal integrity, and minimal conductor loss. Designed to meet IPC-Class-2 standards, the F4BTMS615 PCB is rigorously tested for performance and quality, making it suitable for high-frequency, precision-critical designs.
 
 
Key Construction Details

 
 
PCB Stackup

• Copper Layer 1: 35 μm (1oz), providing excellent electrical conductivity.
• Core Layer: 10mil (0.254mm) F4BTMS615 substrate, offering exceptional dielectric stability and low signal loss.
• Copper Layer 2: 35 μm (1oz), ensuring reliable grounding and signal transmission.

 
 
What is F4BTMS615 Laminate?
The F4BTMS615 laminate, part of the F4BTMS series, is a highly advanced material engineered for high-reliability aerospace, radar, and satellite communication systems. By incorporating nano-ceramics and ultra-thin fiberglass, this material minimizes dielectric loss, reduces dimensional anisotropy, and enhances thermal conductivity. Its low dielectric constant and dissipation factor ensure stable performance across a wide frequency range.
 
 
Key Features of F4BTMS615 Material:

The F4BTMS615 laminate features RTF (low roughness copper foil) for reduced conductor loss and increased peel strength, making it ideal for RF and microwave designs.
 
 
Benefits of the F4BTMS615 PCB
Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) ensures minimal signal attenuation, crucial for high-frequency applications.
 
Stable Dielectric Characteristics: The low dielectric constant (Dk) of 6.15 and stable performance over temperature and frequency provide reliable signal propagation.
 
Dimensional Stability: The nano-ceramic reinforced PTFE construction reduces X/Y/Z anisotropy and ensures excellent mechanical stability.
 
Improved Thermal Performance: With a high thermal conductivity (0.67 W/mK) and low thermal coefficient of Dk, this PCB performs reliably under extreme conditions.
 
High Reliability: The low CTE (10 ppm/°C in X-axis) ensures reliable plated-through holes (PTHs) and reduces the risk of thermal stress damage.
 
Precise Manufacturing: The material’s compatibility with both copper and aluminum bases and its excellent peel strength enable precise PCB fabrication.
 
 
Applications
Aerospace Equipment
Microwave and RF Systems
Radar Systems
Feed Networks
Phase-Sensitive Antennas
Satellite Communications
 
Conclusion
The F4BTMS615 Double-Layer 0.254mm PCB with Immersion Tin finish is a cutting-edge solution for RF and microwave applications requiring exceptional electrical performance, mechanical stability, and thermal reliability. Built with the advanced F4BTMS615 laminate, this PCB delivers low signal loss, minimal dielectric anisotropy, and excellent thermal performance, making it ideal for aerospace, radar, and satellite communication systems.
 
 
With its IPC-Class-2 compliance, rigorous testing, and worldwide availability, this PCB offers a reliable and high-precision platform for your most demanding high-frequency designs.