F4BTMS265 Double-sided Copper Clad Laminate with 1 oz RTF copper foil 0.127mm (5 mil), 0.254mm, 0.508mm, 1.016mm, 1.524mm

F4BTMS265 High-Reliability Copper Clad Laminate Description

The F4BTMS265 is an advanced, aerospace-grade, ceramic-filled PTFE (Polytetrafluoroethylene) laminate, representing a significant technological evolution within the F4BTM series from Taizhou Wangling Insulation Material Factory. Engineered for mission-critical applications, this material incorporates a high volume of specialized ceramic fillers and ultra-thin, ultra-fine glass fabric, resulting in exceptional electrical stability, mechanical integrity, and environmental resilience.

Core Technology and Composition
The material is formulated by blending PTFE resin with a substantial amount of nano-ceramic particles and a minimal quantity of ultra-thin glass fabric. This proprietary composition minimizes the "fiber weave effect" during electromagnetic wave propagation, leading to reduced dielectric loss. It also significantly enhances dimensional stability and isotropy across the X, Y, and Z axes. The material is standardly laminated with 1 oz (0.035mm) RTF (Reverse Treated Foil) low-profile copper, ensuring low conductor loss and excellent peel strength. This high-performance substrate is qualified for applications demanding space-level reliability and is designed to replace imported equivalents.

Key Electrical Specifications
The F4BTMS265 offers a precisely controlled and stable electrical profile up to high frequencies:

Dielectric Constant (Dk): A nominal value of 2.65 at 10 GHz, with an exceptionally tight tolerance of ±0.04.

Dissipation Factor (Df): Exhibits ultra-low loss characteristics: 0.0012 at 10 GHz, 0.0014 at 20 GHz, and 0.0018 at 40 GHz, ensuring minimal signal attenuation.

Dielectric Constant Temperature Coefficient (TcDk): -88 ppm/°C over -55°C to +150°C, demonstrating excellent stability across a wide operational temperature range.

F4BTMS Data Sheet

Standard Product Specifications

Copper Foil: Standard configuration uses 1 oz RTF copper foil. A 0.5 oz (0.018mm) RTF option is available.

Standard Thickness: Available in various dielectric thicknesses based on 0.127mm (5 mil) multiples. The minimum achievable dielectric thickness for F4BTMS265 is 0.127mm. Standard thicknesses (e.g., 0.254mm, 0.508mm, 1.016mm, 1.524mm) are offered with corresponding tight tolerances (e.g., 1.524mm ±0.06mm).

Standard Panel Sizes: Standard sizes include 460mm x 610mm (18"x24") and 610mm x 920mm (24"x36") for manufacturing efficiency.

Mechanical & Thermal Performance:

Peel Strength: >1.8 N/mm (with 1 oz RTF copper).

Coefficient of Thermal Expansion (CTE): XY-direction: 15-20 ppm/°C; Z-direction: 72 ppm/°C (-55°C to +288°C). The low CTE ensures excellent dimensional and plated-through-hole reliability.

Thermal Conductivity (Z-direction): 0.36 W/(m·K), providing improved heat dissipation.

Max Operating Temperature: -55°C to +260°C.

Flammability Rating: UL 94 V-0.

Other Critical Properties:

Volume & Surface Resistivity: ≥1x10⁸ MΩ·cm and ≥1x10⁸ MΩ, respectively, indicating superior insulation performance.

Moisture Absorption: 0.025%, contributing to stable performance in humid conditions.

Thermal Stress Reliability: Passes 3 cycles of 10 seconds at 260°C solder dip without delamination.

Electrical Strength (Z-direction): >34 kV/mm.

Breakdown Voltage (XY-direction): >42 kV.

Density: 2.26 g/cm³.

Typical Applications

Aerospace and Avionics Equipment

Phase-Sensitive and Phased Array Antennas

Satellite Communication Systems

High-Frequency Radar and Military Radar Systems

Feed Networks

High-Layer-Count and Backplane Circuitry

In summary, the F4BTMS265 is a top-tier laminate that delivers a stable Dk of 2.65, ultra-low loss up to 40 GHz, outstanding thermal and dimensional stability, and superior resistance to harsh environments. Its aerospace-grade reliability, combined with excellent manufacturability for complex multilayer boards, makes it an ideal domestic solution for the most demanding RF and microwave applications.