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DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold
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DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold
  • name
  • name

DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise
Certification
UL
Model Number
BIC-295-V2.95
Number Of Layers:
2
Board Material:
PET 25µm
Surface Cu Thickness:
1.0
Board Thickness:
0.20 Mm +/-10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

DiClad 527 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Substrate Introduction

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and improved dimensional stability and registration.

 

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)

18" x 24" (457 x 610mm)

 

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"

0.030" (0.762mm) with a tolerance of +/- 0.0020"

0.060" (1.524mm) with a tolerance of +/- 0.0020"

 

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil

1/2 oz. (18µm)

1 oz. (35µm)

 

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.

 

Key Features:

1. Dk range: 2.40 to 2.60

  • Low dissipation factor: .0018 at 10GHz
  • Low moisture absorption

 

Key Benefits:

1. Stable Dk across a wide frequency range

  • Low circuit losses at high frequencies
  • Minimal performance variation in high humidity environments
  • Excellent dimensional stability
  • Consistent product performance
  • Uniform electrical properties across frequencies
  • Reliable mechanical performance
  • Excellent chemical resistance

 

Our PCB Capability (DiClad 527)

PCB Capability (DiClad 527)
PCB Material: Woven Fiberglass/PTFE composite
Designation: DiClad 527
Dielectric constant: 2.40-2.60 10GHz/23˚C
Dissipation factor 0.0017 10GHz/23˚C
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold 0

Typical Applications:

1. Radar feed networks

  • Commercial phased array networks
  • Low-loss base station antennas
  • Guidance systems
  • Digital radio antennas
  • Filters, couplers, and LNAs

 

DiClad 527 Data Sheet

Typical Value
Properties DiClad 527 Units Test Conditions Test Method
Electrical Properties          
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Dissapation Factor 0.0017   23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissapation Factor 0.0010   23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric
Constant		 -153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 1.2 x 109 MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.5 x 107 MΩ C96/35/90 - IPC TM-650 2.5.17.1
Dielectric Breakdown >45 kV D48/50 - ASTM D-149
Arc Resistance >180   - - ASTM D-495
Thermal Properties          
Coefficient of Thermal Expansion - x 14 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 21 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 173 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.26 W/(m.K)     ASTM E1461
Mechanical Properties          
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH - ASTM D-638
Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH - ASTM D-882
Compressive Modulus 359 kpsi 23˚C @ 50% RH - ASTM D-695
Flex Modulus 537 kpsi 23˚C @ 50% RH   ASTM D-3039
Physical Properties          
Flammability V-0     C48/23/50 &
C168/70		 UL 94
Moisture Absorption 0.03 % E1/105+D24/23   IPC TM-650 2.6.2.2
Density 231 g/cm³ C24/23/50 Method A ASTM D792
NASA
Outgassing		 Total Mass Lost 0.02 % 125°C, ≤ 10-6 torr NASA SP-R-0022A
Collected Volatiles 0.00 %
Water Vapor Recovered 0.01 %

 

DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold 1

 

 

 

Tags: 

high speed pcb,  

high frequency circuit design

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold
  • name
  • name
DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise
Certification
UL
Model Number
BIC-295-V2.95
Number Of Layers:
2
Board Material:
PET 25µm
Surface Cu Thickness:
1.0
Board Thickness:
0.20 Mm +/-10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Black
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

DiClad 527 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Substrate Introduction

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and improved dimensional stability and registration.

 

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)

18" x 24" (457 x 610mm)

 

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"

0.030" (0.762mm) with a tolerance of +/- 0.0020"

0.060" (1.524mm) with a tolerance of +/- 0.0020"

 

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil

1/2 oz. (18µm)

1 oz. (35µm)

 

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.

 

Key Features:

1. Dk range: 2.40 to 2.60

  • Low dissipation factor: .0018 at 10GHz
  • Low moisture absorption

 

Key Benefits:

1. Stable Dk across a wide frequency range

  • Low circuit losses at high frequencies
  • Minimal performance variation in high humidity environments
  • Excellent dimensional stability
  • Consistent product performance
  • Uniform electrical properties across frequencies
  • Reliable mechanical performance
  • Excellent chemical resistance

 

Our PCB Capability (DiClad 527)

PCB Capability (DiClad 527)
PCB Material: Woven Fiberglass/PTFE composite
Designation: DiClad 527
Dielectric constant: 2.40-2.60 10GHz/23˚C
Dissipation factor 0.0017 10GHz/23˚C
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold 0

Typical Applications:

1. Radar feed networks

  • Commercial phased array networks
  • Low-loss base station antennas
  • Guidance systems
  • Digital radio antennas
  • Filters, couplers, and LNAs

 

DiClad 527 Data Sheet

Typical Value
Properties DiClad 527 Units Test Conditions Test Method
Electrical Properties          
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Dissapation Factor 0.0017   23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissapation Factor 0.0010   23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric
Constant		 -153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 1.2 x 109 MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.5 x 107 MΩ C96/35/90 - IPC TM-650 2.5.17.1
Dielectric Breakdown >45 kV D48/50 - ASTM D-149
Arc Resistance >180   - - ASTM D-495
Thermal Properties          
Coefficient of Thermal Expansion - x 14 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 21 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 173 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity 0.26 W/(m.K)     ASTM E1461
Mechanical Properties          
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH - ASTM D-638
Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH - ASTM D-882
Compressive Modulus 359 kpsi 23˚C @ 50% RH - ASTM D-695
Flex Modulus 537 kpsi 23˚C @ 50% RH   ASTM D-3039
Physical Properties          
Flammability V-0     C48/23/50 &
C168/70		 UL 94
Moisture Absorption 0.03 % E1/105+D24/23   IPC TM-650 2.6.2.2
Density 231 g/cm³ C24/23/50 Method A ASTM D792
NASA
Outgassing		 Total Mass Lost 0.02 % 125°C, ≤ 10-6 torr NASA SP-R-0022A
Collected Volatiles 0.00 %
Water Vapor Recovered 0.01 %

 

DiClad 527 High Frequency PCB mutilayer 20mil 0.508mm With Immersion Gold 1

 

 

 

Tags: 

high speed pcb,

high frequency circuit design

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