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F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based

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F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based

Name: F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based
Brand: Bicheng Enterprise
SKU: BIC-251-V2.51
Price: 2.99 USD
Availability: InStock
Rating: 4.8 (127 reviews)

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Enterprise

Certification

Model Number

BIC-251-V2.51

Number Of Layers:

Single Sided PCB

Glass Epoxy:

Polyimide 0.1mm, FPC

Final Foil:

1.0

Final Height Of PCB:

0.1mm ±0.05

Surface Finish:

Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)

Solder Mask Color:

Yellow

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

F4BTM High Frequency PCB

Introduction

This series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.

F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, suitable for applications without PIM requirements, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

Features & Benefits

- DK range from 2.98 to 3.5 is available

- Addition of ceramics enhances the performance.

- F4BTME exhibits excellent PIM performance,

- Comes in various thicknesses and sizes, offers cost savings

- Commercialization, large-scale production, and high cost-effectiveness.

- Radiation-resistant and low out-gassing properties

Models & Data Sheet

Product Technical Parameters				Product Models & Data Sheet
Product Features		Test Conditions	Unit	F4BTM298	F4BTM300	F4BTM320	F4BTM350
Dielectric Constant (Typical)		10GHz	/	2.98	3.0	3.2	3.5
Dielectric Constant Tolerance		/	/	±0.06	±0.06	±0.06	±0.07
Loss Tangent (Typical)		10GHz	/	0.0018	0.0018	0.0020	0.0025
Loss Tangent (Typical)		20GHz	/	0.0023	0.0023	0.0026	0.0035
Dielectric Constant Temperature Coefficient		-55 º~150ºC	PPM/℃	-78	-75	-75	-60
Peel Strength		1 OZ F4BTM	N/mm	>1.6	>1.6	>1.6	>1.6
Peel Strength		1 OZ F4BTME	N/mm	>1.4	>1.4	>1.4	>1.4
Volume Resistivity		Standard Condition	MΩ.cm	≥1×10^7	≥1×10^7	≥1×10^7	≥1×10^7
Surface Resistivity		Standard Condition	MΩ	≥1×10^6	≥1×10^6	≥1×10^6	≥1×10^6
Electrical Strength (Z direction)		5KW,500V/s	KV/mm	>26	>30	>32	>32
Breakdown Voltage (XY direction)		5KW,500V/s	KV	>34	>35	>40	>40
Coefficientof Thermal Expansion	XY direction	-55 º~288ºC	ppm/ºC	15,16	15,16	13,15	10,12
Coefficientof Thermal Expansion	Z direction	-55 º~288ºC	ppm/ºC	78	72	58	51
Thermal Stress		260℃, 10s,3 times		No delamination	No delamination	No delamination	No delamination
Water Absorption		20±2℃, 24 hours	%	≤0.05	≤0.05	≤0.05	≤0.05
Density		Room Temperature	g/cm3	2.25	2.25	2.20	2.20
Long-Term Operating Temperature		High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity		Z direction	W/(M.K)	0.42	0.42	0.50	0.54
PIM		Only applicable to F4BTME	dBc	≤-160	≤-160	≤-160	≤-160
Flammability		/	UL-94	V-0	V-0	V-0	V-0
Material Composition		/	/	PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

Our PCB Capability (F4BTM)

PCB Capability (F4BTM)
PCB Material:	PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM )	F4BTM	DK (10GHz)	DF (10 GHz)
	F4BTM298	2.98±0.06	0.0018
	F4BTM300	3.0±0.06	0.0018
	F4BTM320	3.2±0.06	0.0020
	F4BTM350	3.5±0.07	0.0025
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

F4BTM PCB and Applications

The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.

This type of PCB is utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency.

F4BTM High Frequency PCB Built On formulating fiberglass cloth With aluminum-based or copper-based 0

Final (F4BTM series aluminum-based/copper-based substrates)

F4BTM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based or copper-based material. This arrangement serves the purpose of shielding or heat dissipation.

For examples, F4BTM300-AL represents F4BTM300 with aluminum-based substrate.

About us

Based in China, Bicheng PCB adheres to the philosophy of helping small and medium sized companies reduce their cost and time spent on PCB. We provide a variety of PCB products to meet the demands.

Our Driving Circuit Boards Capabilities 2019

Blind vias, Buried vias

Flex PCB

Heavy Copper Boards 12oz

High Tg, High CTI Material

Hybrid FR-4 and High Frequency Material

Impedance Controlled PCB

IPC Class 2, IPC Class 3

Lead Free PCB (RoHS Compliant)

Multilayer PCBs to 32+ copper layers boards

Metal Core PCB (MCPCB)

PCB Materials – FR-4, Polyimide, Rogers & More

RoHS Compliant PCB Manufacturer

Rigid Flex PCB

RF PCB / High Frequency PCB

Through-hole, BGA, Gold Finger, Edge dome

Via-in-pad, Filled vias

TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified

Our Services

Focus on Prototypes, Small Batches, Volume Production

Quick turn-around, double sided PCB 24 hours available.

Door to door shipment service

Our Clients are located worldwide.

Australia: Perth, Melbourne, New South Wales, South Australia, West Australia

Austria: Breitenfurt bei Wien, Graz

Bangladesh: Purana Paltan

Belgium: Deinze, Hasselt

Bulgaria: Plovdiv

Brazil: Caxias do Sul

Canada: Quebec, Ontario, Vancouver

Czech: Pardubice, Horní Pocernice

France: Villeneuve La Garenne Cedex, Montchenu

Germany: Stuttgart, Garbsen, Hamburg, Altenburg, Velbert Kleinmachnow, Potsdam

Hungary: Budapest

India: Tamilnadu

Ireland: Cork

Israel: Nettanya City, Ben-Gurion Airport, Tel Aviv, Yahud, Acre,

Italy: Peschiera Borromeo, Verona, Mezzocorona, Pietrasanta Lucca, Torino

Kuwait: Safat

Malta: Mosta

Malaysia: Selangor

Mexico: Leon Guanajuato

Portugal: Guimaraes

South Korea: Gyeonggi-DO

Serbia: Kragujevac

Sweden: Goteborg, Siljansns,

Thailand: Bangkok, Chonburi

Turkey: Ankara, Istanbul, Kocaeli

The Netherlands: Diemen

UK: Bristol, Surrey

Ukraine: Kiev

USA: Connecticut, Alaska, New York City, Miami,, New Jersey, Texas, Colorado, Largo, California, Candler

Vietnam: HoChiMinh City

Zambia: Kitwe

Tags:

high speed pcb,

high frequency circuit design

F4BTME High Frequency PCB with reverse-treated (RTF) copper foil

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