MOQ: | 1 |
Price: | USD 20-30 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T, Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Product profile
1.1 General description
This is a type of 4 layer flexible circuit for the application of Industrial Systems.
The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using
supplied Gerber data. FR-4 as stiffner is applied on the inserting part.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Quick and on-time delivery
L. Eligible products rate of first production: >95%
1.3 Application
Display backlight, Mobile phone module flex board, Industrial control computer
soft board
1.4 Parameter and data sheet
Size of Flexible PCB | 170.48 X 40.28mm |
Number of Layers | 4 |
Board Type | Flexible PCB |
Board Thickness | 0.25mm |
Board Material | Polyimide 50µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60℃ |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | 35 µm |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | FR-4 |
Stiffener Thickness | 1.0mm |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
MOQ: | 1 |
Price: | USD 20-30 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T, Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Product profile
1.1 General description
This is a type of 4 layer flexible circuit for the application of Industrial Systems.
The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using
supplied Gerber data. FR-4 as stiffner is applied on the inserting part.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Quick and on-time delivery
L. Eligible products rate of first production: >95%
1.3 Application
Display backlight, Mobile phone module flex board, Industrial control computer
soft board
1.4 Parameter and data sheet
Size of Flexible PCB | 170.48 X 40.28mm |
Number of Layers | 4 |
Board Type | Flexible PCB |
Board Thickness | 0.25mm |
Board Material | Polyimide 50µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60℃ |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | 35 µm |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | FR-4 |
Stiffener Thickness | 1.0mm |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |