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Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

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Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

Name: Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill
Brand: Bicheng Technologies Limited
SKU: BIC-78-V1.05
Price: 9.99 USD
Availability: InStock
Rating: 4.7 (183 reviews)

MOQ:	1
Price:	USD 9.99-99.99
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T
Supply Capacity:	50000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-78-V1.05

Number Of Layers:

Glass Epoxy:

RO4350B Tg280℃, Er<3.48, Rogers Corp; FR-4 IT158

Final Foil:

1 Oz

Final Height Of PCB:

1.3 Mm ±10%

Surface Finish:

Immersion Gold

Solder Mask Color:

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 9.99-99.99

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T

Supply Ability:

50000 pieces per month

Product Description

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,

Today, we're talking about 4-layer high frequency PCB made on 10mil RO4350B pressed with FR-4.

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

Let's take a look at first build-up,

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 0

The first layer to the second layer is 10mil RO4350B core material, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the other layers are FR-4 materials, which are bonded by semi-cured sheets. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

Following picture is the cross section.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 1

Plated through holes connect each layer. Pads and vias are with immersion gold.

The second board has a special “hole” in the board. See the build-up first.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 2

Layer 1 and layer 2 is the 10mil core. The depth-control drill is dented on FR-4 side. The whole height of this board is only 0.7mm thick.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 3

The applications of 10mil RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

The advantages of 10mil RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Benefit from our strong capabilities: meeting your PCB needs from prototype to mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

Thank you for your reading. You’re welcome to contact us for our RF PCB enquiries.

Appendix: Our PCB Capability 2022

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.