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High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4
  • name
  • name

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

MOQ: 1
Price: USD2.99-8.99 Per Piece
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0075-V5.4
Glass Epoxy:
RO4003C Tg280℃, Er<3.48, Rogers Corp.
Final Height Of PCB:
1.6 Mm ±0.16mm
Final Foil External:
1.5 Oz
Surface Finish:
Immersion Gold
Solder Mask Color:
Green, LP-4G/G-05, Nanya Supplied.
Colour Of Component Legend:
White, S-380W, Taiyo Brand
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD2.99-8.99 Per Piece
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we’re going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.

 

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

 

Let’s see today’s first board.

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 0

 

Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.

 

The 2nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 1

 

The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

 

The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 2

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

 

Our PCB Capability (Hybrid Design)

PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
Duroid/RT5880 + RO4350B
Duroid/RT5880 + FR4
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP

 

At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ℃ thermal stress test to ensure high quality PCB shipped to your hands.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
 
Appendix: Data Sheet of RO4003C
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z   10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		   MPa
(kpsi)		   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		   N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        
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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4
  • name
  • name
High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4
MOQ: 1
Price: USD2.99-8.99 Per Piece
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0075-V5.4
Glass Epoxy:
RO4003C Tg280℃, Er<3.48, Rogers Corp.
Final Height Of PCB:
1.6 Mm ±0.16mm
Final Foil External:
1.5 Oz
Surface Finish:
Immersion Gold
Solder Mask Color:
Green, LP-4G/G-05, Nanya Supplied.
Colour Of Component Legend:
White, S-380W, Taiyo Brand
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD2.99-8.99 Per Piece
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we’re going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.

 

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

 

Let’s see today’s first board.

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 0

 

Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.

 

The 2nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 1

 

The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

 

The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 2

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

 

Our PCB Capability (Hybrid Design)

PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
Duroid/RT5880 + RO4350B
Duroid/RT5880 + FR4
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP

 

At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ℃ thermal stress test to ensure high quality PCB shipped to your hands.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
 
Appendix: Data Sheet of RO4003C
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z   10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		   MPa
(kpsi)		   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		   N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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