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Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
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Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
  • name
  • name

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0073-V1.12
Number Of Layers:
3
Glass Epoxy:
RO4350B+ RT/duroid 5880
Final Foil:
1.0
Final Height Of PCB:
1.8 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Product Description

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.

 

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 0

 

This is a 3-layer board that one layer is etched off.

 

The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

Features and benefits

1) Lowest electrical loss for reinforeced PTFE material

2) Enhanced electrical performance;

3) 16000 square meter workshop;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 17 years of PCB experience;

 

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

 

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A
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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
  • name
  • name
Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0073-V1.12
Number Of Layers:
3
Glass Epoxy:
RO4350B+ RT/duroid 5880
Final Foil:
1.0
Final Height Of PCB:
1.8 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Product Description

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.

 

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 0

 

This is a 3-layer board that one layer is etched off.

 

The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

Features and benefits

1) Lowest electrical loss for reinforeced PTFE material

2) Enhanced electrical performance;

3) 16000 square meter workshop;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 17 years of PCB experience;

 

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

 

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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