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Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials

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Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials

Name: Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials
Brand: Bicheng Technologies Limited
SKU: BIC-0076-V3.6
Price: 9.99 USD
Availability: InStock
Rating: 4.8 (108 reviews)

MOQ:	1
Price:	USD 9.99-99.99
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T
Supply Capacity:	50000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-0076-V3.6

Number Of Layers:

Glass Epoxy:

RO4003C Tg280℃, Er<3.48, Rogers Corp.

Final Foil External:

1oz

Final Height Of PCB:

1.6 Mm ±10%

Surface Finish:

Immersion Gold, 85%

Solder Mask Color:

Green

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 9.99-99.99

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T

Supply Ability:

50000 pieces per month

Product Description

Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,

Warm greetings!

Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.

Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials 0

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.

Let's take a look at its micro-section chart.

Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials 1

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials 2

Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.

Hybrid PCB Board Bulit On Rogers 20mil RO4003C and 0.75mm FR-4 High Frequency Multi-layer PCB with Mixed Materials 3

The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.

The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

Our PCB Capability (Hybrid Design)

PCB Type:	Hybrid PCB, Mixed PCB
Mixed type:	RO4350B + FR4;
	RO4003C + FR4;
	F4B + FR4;
	Duroid/RT5880 + RO4350B
	Duroid/RT5880 + FR4
Solder mask:	Green, Red, Blue, Black, Yellow
Layer count:	4 Layer, 6 Layer, Multilayer
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	1.0-5.0mm
PCB size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, OSP

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

Appendix: Data Sheet of RO4003C

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23℃ 2.5 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 1010		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 109		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150℃	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/℃	-55℃to288℃	IPC-TM-650 2.4.41
Tg	>280		℃ TMA	A	IPC-TM-650 2.4.24.3
Td	425		℃ TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/oK	80℃	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50℃	ASTM D 570
Density	1.79		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

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