F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF

Product Description

When an aerospace RF design demands both low dielectric constant and ultra-thin construction, material options narrow quickly. The F4BTMS233 from Taizhou Wangling Insulation Materials Factory addresses this niche directly: an aerospace-grade, ceramic-filled PTFE laminate with a Dk of 2.33, available in dielectric thicknesses as thin as 0.09mm (3.5 mil), and engineered to replace comparable foreign products.

The F4BTMS series is an upgraded version of the F4BTM series, achieving a technological breakthrough in material formulation and manufacturing processes. By incorporating a small amount of ultra-thin, ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with PTFE resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases X/Y/Z anisotropy, while increasing the usable frequency range, improving electrical strength, and enhancing thermal conductivity.

The F4BTMS series comes standard with RTF low-roughness copper foil, reducing conductor loss while providing excellent peel strength. It can be paired with copper or aluminum bases, and F4BTMS294 can be combined with 50Ω resistive copper foil to form resistive laminates. The material processes using standard PTFE board fabrication techniques and is suitable for multilayer, high-layer-count, and backplane processing, with excellent machinability for dense vias and fine traces.

Key Properties at a Glance (F4BTMS233):

Applications

The F4BTMS233 laminate is engineered for aerospace, defense, and high-frequency applications where low Dk and thin construction are essential, including:

1. - Aerospace equipment, space and cabin equipment
2. - Microwave, RF
3. - Radar, military radar
4. - Feed networks
5. - Phase-sensitive antennas, phased array antennas
6. - Satellite communications, and more.

Custom PCB Manufacturing on F4BTMS233

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using F4BTMS233 and other advanced materials. The following specification details a representative 2-layer ultra-thin implementation:

PCB Construction Details:

Ultra-Thin Core Capability:

F4BTMS233 is available in dielectric thicknesses as thin as 0.09mm (3.5 mil), with additional options in multiples of 0.09mm or 0.127mm. This enables extremely thin, lightweight constructions—essential for aerospace payloads and compact millimeter-wave designs where every gram and millimeter counts.

Low and Tightly Controlled Dielectric Constant:
With a Dk of 2.33 ± 0.03 at 10 GHz, F4BTMS233 offers excellent batch-to-batch consistency (±0.03 tolerance), ensuring repeatable circuit performance and minimizing tuning requirements in production.

Ultra-Low Loss Across Broad Frequency Range:
The material delivers exceptional loss performance with a dissipation factor of 0.0010 at 10 GHz, 0.0011 at 20 GHz, and 0.0015 at 40 GHz. It maintains stable Dk and low loss from 0.5 to 40 GHz, meeting the demands of phase-sensitive applications across multiple frequency bands.

Excellent Temperature Stability:
The dielectric constant temperature coefficient of -122 ppm/°C over -55°C to +150°C provides stable frequency and phase performance across temperature. The material's usable temperature range far exceeds this window, supporting operation from -55°C to +260°C.

Aerospace-Grade Reliability:
F4BTMS233 exhibits excellent radiation resistance, maintaining stable dielectric and physical properties after radiation exposure. Its low outgassing performance meets aerospace vacuum outgassing requirements, making it suitable for space and cabin equipment.

Reduced Anisotropy and Dimensional Stability:
The ultra-thin, ultra-fine glass fiber reinforcement combined with nano-ceramics reduces X/Y/Z anisotropy and provides excellent dimensional stability. This ensures thermal dimensional stability and plated through-hole reliability.

Low Moisture Absorption:
At 0.02%, F4BTMS233 absorbs minimal moisture, maintaining stable electrical properties in humid environments.

Standard RTF Copper Foil:
RTF low-roughness copper foil comes standard, reducing conductor loss while providing excellent peel strength (>2.4 N/mm for 1 oz RTF).

Metal-Backed Options:
The material can be supplied with copper or aluminum bases (F4BTMS233—CU or F4BTMS233—AL) for shielding or heat dissipation, with metal base thicknesses from 0.48 mm to 3.98 mm and panel sizes up to 460×610mm.

Resistive Copper Foil Option:
For designs requiring embedded resistors, F4BTMS233 can be paired with 50Ω resistive copper foil (nickel-phosphorus alloy, 0.2 μm thick, 50±5Ω per square centimeter).

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and aerospace applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, ultra-thin configurations, metal-backed options (copper or aluminum), resistive copper foil, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.