Product Description
1. Material Overview – RO4003C (Rogers)
RO4003C is a hydrocarbon ceramic laminate from Rogers Corporation, specifically designed for high-frequency RF/microwave applications. It offers superior high-frequency performance and low-cost circuit fabrication using standard epoxy/glass (FR-4) processes .
Key Material Characteristics
| Feature |
Benefit |
| Dk = 3.38 ± 0.05 @ 10 GHz |
Low and stable dielectric constant – consistent impedance across frequency |
| Df = 0.0027 @ 10 GHz |
Very low dissipation factor – minimizes insertion loss |
| Tg > 280°C (TMA) |
High thermal stability – supports lead-free assembly |
| Td = 425°C |
Excellent thermal decomposition resistance – robust for harsh environments |
| TCDk = +40 ppm/°C |
Stable Dk across temperature (-50°C to 150°C) |
| CTE X/Y = 11–14 ppm/°C |
Matches copper's CTE – reduces PTH stress |
| Moisture Absorption = 0.06% |
Maintains electrical stability in humid environments |
| FR-4 process compatible |
No sodium etch or plasma desmear required – standard fabrication . |
| UL 94 V-0 |
Meets safety requirements . |
RO4450F Bondply
RO4450F is a low-flow, thermoset prepreg specifically developed for bonding RO4000 series laminates in multilayer constructions . Key attributes:
| Property |
Value |
| Resin System |
Hydrocarbon ceramic |
| Flow Characteristics |
Low-flow – minimizes resin bleed during lamination |
| Dielectric Constant |
~3.52 |
| Processing |
Compatible with standard FR-4 lamination cycles |
| Cured Thickness |
Dependent on glass style and pressure |
Multi-Layer Bonding
RO4450F bondply is used for bonding RO4003C cores. Guidelines for the adhesive system should be consulted for bond cycle parameters .
Typical Lamination Conditions:
| Parameter |
Recommendation |
| Press Type |
Hydraulic or vacuum press |
| Temperature |
190–210°C |
| Pressure |
300–400 psi |
| Dwell Time |
60–90 minutes |
| Cooling |
Controlled cooling to <100°C before removal |
Drilling
Standard entry (aluminum or thin pressed phenolic) and exit (pressed phenolic or fiberboard) materials can be used. Drilling speeds greater than 500 SFM should be avoided .
Recommended Drilling Parameters:
| Parameter |
Recommended Range |
| Surface Speed |
300–500 SFM (90–150 m/min) |
| Chip Load |
0.002–0.004"/rev. (0.05–0.10 mm) |
| Retract Rate |
500 IPM for tools < 0.0135"; 1,000 IPM for all others |
| Tool Type |
Standard carbide |
| Tool Life |
2,000–3,000 hits |
Custom PCB – 4-Layer RO4003C + RO4450F Hybrid with Via-in-Pad & IPC Class 3
This 4-layer board demonstrates our capability to process RO4000 series materials with RO4450F bondply , advanced via-in-pad , and IPC-6012 Class 3 compliance .
Basic Specifications
| Item |
Specification |
| Layer Count |
4 layers |
| Stack-Up |
0.203mm RO4003C + RO4450F (2× prepreg) + 0.203mm RO4003C |
| Finished Pressed Thickness |
0.75mm |
| Copper Weight |
1 oz / 1 oz / 1 oz / 1 oz (all layers) |
| Surface Finish |
ENIG (2µ" gold over nickel) |
| Solder Mask (Top) |
Green with black nomenclature |
| Solder Mask (Bottom) |
Green with no nomenclature |
| Panel Size |
98mm × 62mm (1 piece) |
Stack-Up Cross-Section
Application Areas
- RF/Microwave Modules
- 5G Small Cells / Base Stations
- Automotive Radar Sensors
- Satellite Communications
- High-Speed Digital
Q1: What makes RO4003C different from standard FR-4?
A: RO4003C offers significantly lower Dk (3.38 vs. ~4.5) and Df (0.0027 vs. ~0.015–0.020) , higher Tg (>280°C) , stable Dk across temperature (TCDk = +40 ppm/°C) , and CTE matched to copper (11–14 ppm/°C) – all while remaining FR-4 process compatible .
Q2: Does RO4003C require special processing like PTFE materials?
A: No. Unlike PTFE, RO4003C does not require sodium etch or plasma desmear for through-hole preparation. It processes using standard FR-4 fabrication techniques .
Q3: What is RO4450F bondply, and why is it used?
A: RO4450F is a low-flow, thermoset prepreg specifically developed for bonding RO4000 series laminates in multilayer constructions. It minimizes resin bleed during lamination and provides excellent adhesion between cores .
Q4: What is the recommended lamination temperature for RO4450F?
A: Typical lamination temperature is 190–210°C with 300–400 psi pressure and 60–90 minutes dwell time. Controlled cooling to <100°C before removal is recommended.
Q5: Can all vias be resin-plugged and capped (via-in-pad)?
A: Yes. Our manufacturing process supports resin plugging + electroplated capping for all vias. This is standard for this 4-layer design and enables component placement directly over vias.
Q6: What surface finishes are available for RO4003C?
A: RO4003C is compatible with OSP, HASL, ENIG, immersion silver, immersion tin, and most chemically deposited or electroplated finishes .
Q7: What is the shelf life of RO4003C laminates?
A: RO4003C laminates can be stored for extended durations at ambient room temperatures (55–85°F, 13–30°C) . Copper claddings may oxidize during exposure to high humidity (removed by standard micro-etch) . Over >5 years, the exposed dielectric along panel edges may experience detectable oxidation, which is accounted for by standard tooling hole loss .
Contact Us
As a specialized PCB supplier based in China, we have extensive experience with Rogers RO4000 series materials , RO4450F bondply , and complex via-in-pad processes .
We provide:
- Full material traceability (certificates from Rogers)
- IPC-6012 Class 3 qualification with 25µm hole wall copper
- Via-in-pad fabrication (resin plugging + capping)
- ENIG and other surface finishes per your requirements
- Impedance testing (TDR) with detailed reports
- X-ray and cross-section inspection for via quality
- Quick-turn prototypes and volume production
For technical inquiries, stack-up review, or quotation requests, please contact our sales team directly. We are ready to support your RF/microwave and high-frequency projects.
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