Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards

Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards

  • Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards
  • Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards
Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0314-V3.14
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm Board Thickness: 0.25 Mm
Surface/Inner Layer Cu Thickness: 70 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)



Rogers RO4830 high frequency laminates are thermoset materials that offer a reliable and cost-effective alternative to conventional PTFE-based laminates. They are particularly well-suited for millimeter wave applications where cost considerations are important, such as automotive radar sensors operating in the 76-81 GHz range. RO4830 laminates can be manufactured using standard FR-4 processes and are designed to be used as the cap layer in FR-4 multi-layer board designs commonly employed in 76-81 GHz automotive radar sensor PCB applications.


Compared to PTFE-woven glass laminates, RO4830 laminates exhibit a slightly higher dielectric constant of 3.2 at 77 GHz. The use of low profile reverse treated copper foil cladding contributes to excellent insertion loss performance of RO4830 laminates at 77 GHz, achieving 2.2 dB per inch. The laminates also benefit from a flat woven e-glass and a filler with smaller and more uniform particle size, resulting in good laser drilling capabilities. Additionally, RO4830 laminates contain an advanced anti-oxidant package that provides significant resistance to oxidation, surpassing other hydrocarbon-based laminate materials. These laminates have a UL 94 V-0 flame retardant rating and are compatible with lead-free solder processes.


Key Features:

1. Dielectric constant of 3.24

2. Excellent insertion loss of 2.2 dB/in at 77 GHz

3. UL 94 V-0 flame retardant rating

4. Optimized filler, resin, and glass composite system

5. Reverse treated smooth low profile copper foil



  • Remarkable resistance to oxidation
  • Consistent within-sheet dielectric constant for reliable laser drilling performance
  • Lower overall cost compared to PTFE laminate options, contributing to reduced PCB manufacturing expenses
  • Ideal for automotive radar sensor PCB applications


Our PCB Capability (RO4830)

PCB Capability (RO4830)
PCB Material: Hydrocarbon/ Ceramic/ Spread Woven Glass
Designation: RO4830
Dielectric constant: 3.24
Dissipation factor 0.0033-0.0032
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 5mil (0.127mm), 9.4mil (0.239mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..



Typical Applications:

76-81 GHz Automotive Radar Sensors


RO4830 Data Sheet

Property Typical Values [1]
Units Condition Test Method
Dielectric Thickness
0.005” 0.0095”
Dielectric Constant, εr Design 3.24 3.24 - 77 GHz microstrip differential phase length
Transmission Line Loss 2.2 1.8 dB/in 77 GHz microstrip differential phase length
Dissipation Factor, tan δ 0.0033 0.0032 - 10 GHz split-post dielctric resonator
Thermal Coefficient of εr (z direction) -30 -30 ppm/°C -50°C to 150°C IPC-TM-650
Dielectric Strength 78.7 59.1 kV/mm 48 hrs @ 50°C IPC-TM-650,
2000 1500 V/mil
Water Absorption 0.15 0.13 % D-48/50 ASTM D570
Peel Strength after Thermal Stress 0.67 0.67 N/mm 18 micron reverse
treated EDfoil
IPC-TM-650 2.4.8
3.8 3.8 lbs/in
Flammability Rating V-0 V-0 - C-48/23/50 UL94
MD -1.8
-1.5 (-1.5) mm/m (mils/in) 4 hrs @ 105°C IPC-TM-650 2.4.39A
CMD -1.8
-1.6 (-1.6)
Decomposition Temperature 408 412 °C - ASTM D3850
Time to Delamination (T288) >30 >30 minutes with Cu IPC-TM-650,
Lead-Free Process Capable YES YES - - -
Thermal Conductivity (calculated) 0.45 0.47 W/mK 50°C Through-plane calculation with series
mixing rule
CTE x,y 23 21 ppm/°C 0 to 150°C IPC-TM-650 2.4.41
z 110 83


About Bicheng

Established in 2003, Bicheng Electronics Technology Co., Ltd has become a reputable supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 20 years of experience, we have been serving various industries worldwide, including cellular base station antennas, satellites, high-frequency passive components, microstrip line and band line circuits, millimeter wave equipment, radar systems, digital radio frequency antennas, and more.


Our high-frequency PCBs primarily utilize three renowned material brands: Rogers Corporation, Taconic, and Wangling. These materials offer a wide range of dielectric constants, ranging from 2.2 to 10.2, ensuring versatility and suitability for different applications.


In addition to high-frequency PCBs, we also specialize in FR-4 circuit boards, flexible circuits, and metal core PCBs. Our capabilities cover everything from prototyping and small runs to large-scale production. Furthermore, we actively engage in research and development of high-value-added PCB projects, including HDI (high-density interconnect), quick turn, impedance control, heavy copper, and backplane boards. This diversification allows us to offer a comprehensive product line that caters to both low-end and high-end requirements.


Our PCBs find applications across a wide spectrum of industries, such as computer networking, safety and surveillance, power supply, telecommunications, automotive electronics, medical apparatus and instruments, national defense, and industrial equipment. We strive to meet the diverse needs of our customers and provide reliable PCB solutions for various purposes.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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