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Metal Core PCB Built On Aluminum Base With Countersink Holes and Immersion Gold

Minimum Order Quantity : 1 Price : USD20~30
Packaging Details : Vacuum Delivery Time : 5-6 working days
Payment Terms : T/T, Paypal Supply Ability : 45000 pieces per month
Place of Origin: China Brand Name: Bicheng Enterprise Limited
Certification: UL Model Number: BIC-0577-V5.77

Detail Information

Thermal Conductivity: 1W/MK Dielectric Material, MCPCB Final Height Of PCB: 1.6mm ±0.16
Final Foil External: 1 Oz Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color: White,PSR400 WT02 Colour Of Component Legend: No Silkscreen Required
TEST: 100% Electrical Test Prior Shipment

Product Description

General Profile

 


Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.

 

 

 

Advantages

 


1) Effective heat dissipation reduces the operating temperature of the module
    and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
     interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;

 

 

 

Applications

 


LED lighting, Switch regulator, DC/AC converter, Communication electronic
equipment, A filter electric circuit, Office automation equipment, Motor driver,
Motor controller, Automobile etc.

 

 

 

Metal Core PCB Capability

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating

HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm,

Ni 2.5-5µm

5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness

0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),

3OZ(105µm),4OZ(140µm) to 10oz (350µm)

10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm)
17 Tolerance of NPTH ±0.00197" (0.05mm)
18 Deviation of Hole Position ±0.00394" (0.10mm)
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃ 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

 

Metal Core PCB Built On Aluminum Base With Countersink Holes and Immersion Gold

Metal Core PCB Built On Aluminum Base With Countersink Holes and Immersion Gold

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