Wangling's Ultra-Thin F4BM217 PCB built on 3.9mil laminate with ENIG

Elevate Your High-Frequency Designs with Wangling's Ultra-Thin F4BM217 PCB

For those seeking uncompromising performance in their high-frequency designs, the exceptional F4BM217 2-layer PCB from Wangling is poised to redefine the boundaries of what's possible.

Unrivaled Electrical Prowess

At the core of this marvel lies the legendary F4BM217 laminate, a material engineered through the scientific formulation and precise pressing of fiberglass cloth, PTFE resin, and PTFE film. Boasting a dielectric constant (Dk) of 2.17 ± 0.04 at 10GHz and a remarkably low dissipation factor of just 0.001, this substrate is designed to ensure unparalleled signal integrity for the most demanding high-frequency applications.

Engineered for Reliability

Measuring a compact 120mm x 89mm with a tight tolerance of ±0.15mm, this 2-layer F4BM217 PCB features an impressively slim 0.17mm finished thickness and robust 1oz (1.4 mils) copper layers. Engineered with a CTE closely matched to copper, this solution is designed to resist warpage and deformation, delivering unwavering dimensional stability even in the most challenging environments. Furthermore, the Immersion Gold surface finish guarantees reliable and long-lasting solderability for critical components.

Versatility Meets Performance

Whether the focus is on microwave, RF, and radar systems, phase shifters, passive components, or any other mission-critical high-frequency design, the F4BM217 2-layer PCB is poised to excel. Its exceptional electrical performance, combined with its robust construction and environmental friendliness, make it the ideal choice for pushing the boundaries of what's possible in the world of high-frequency electronics.

The F4BM217 2-layer PCB solution from Wangling is available worldwide, ready to unlock the future of high-frequency design. Experience the unparalleled power and reliability that only a true industry leader can deliver.