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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

  • High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
  • High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
  • High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
  • High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
  • High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-480-V6.09
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Board Material: FR-4 Board Thickness: 2.0mm
Surface Cu Thickness: 35 µm (1 Oz) Surface Finish: Immersion Gold
Coverlay Colour: Green Color Of Silkscreen: White
Function: 100% Pass Electrical Test

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170 With Immersion Gold

 

1.1 General description

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

 

1.2 Our Advantages

1. ISO9001, ISO14001, IATF16949, UL Certified;

2. Prototype to volume Production Capability;

3. 16000㎡ workshop;

4. 30000㎡ output capability per month;

5. 8000 types of PCB's per month;

6. IPC Class 2 / IPC Class 3;

7. Eligible products rate of first production: >95%

 

1.3 Applications of HDI PCBs

Automotive, GPS Trackers

5G WiFi, Embedded Systems Basics

Smartphones and tablets

Wearable technology and Healthcare

Access Control Solutions and Aerospace

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 0

 

1.4 Parameter and data sheet

Number of Layers 14-Layer
Board Type Multilayer PCB
Board size 220mm x 170mm=4PCS
Board Thickness 2.0 mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
 
PTH Cu thickness ≥20 um
Inner Iayer Cu thicknes 18 um (0.5oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Mininum Trace (mil) 5.8 mil
Minimum Gap(mil) 6.2 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1

 

1.5 Different Types of HDI PCBs

To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:

1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.

I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.

Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.

 

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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