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Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

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Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

Name: Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
Brand: Bicheng Technologies Limited
SKU: BIC-452-V6.04
Price: 9.99 USD
Availability: InStock
Rating: 4.7 (128 reviews)

MOQ:	1
Price:	USD 9.99-99.99
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Paypal
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-452-V6.04

Board Material:

FR-4

Board Thickness:

1.6mm

Surface Cu Thickness:

35 µm

Surface Finish:

Immersion Gold

Solder Mask:

Green

Color Of Silkscreen:

White

Function:

100% Pass Electrical Test

Minimum Order Quantity:

Price:

USD 9.99-99.99

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Paypal

Supply Ability:

45000 pieces per month

Product Description

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile phone with blind via technology. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and Benefits

1.2.1 Middle Tg FR-4 Shows low Z-CTE and excellent through hole reliability;

1.2.2 Immersion gold has high solderability, no stressing and less contamination;

1.2.3 Multilayer shortened connection between electronic components;

1.2.4 16000㎡ workshop and 8000 types of PCB's per month;

1.2.5 Delivery on time: >98%

1.2.6 No minimum order quantity. 1 piece is available;

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 0

1.3 Applications

Industrial Computer

GPS Tracking System

POS Cash Register

Embedded Systems

Data Acquisition System

Microcontrollers

PC and Notebook

1.4 Parameter and data sheet

PCB SIZE	119 x 80mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Core FR-4 0.61mm
	copper ------- 35um(1oz) MidLayer 1
	Prepreg 0.254mm
	copper ------- 35um(1oz) MidLayer 2
	Core FR-4 0.61mm
	copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.3 mm /3.5 mm
Number of Different Holes:	9
Number of Drill Holes:	415
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 Tg150℃, er<5.4.IT-158, ITEQ
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, stamp holes.
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 1

1.5 Composition of Holes

The blind hole is located on the top and bottom surface of the printed circuit board and has a certain depth for the connection between the surface line and the inner line below. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole is a connecting hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.

The above two kinds of holes are located in the inner layer of the circuit board. The formation of through hole process is used before lamination, and several inner layers may be overlapped done during the formation of the through hole.

The third is called a through hole, which passes through the entire circuit board. It can be used to interconnect internally or as an installation location hole for components. Because the through hole is easier to realize and the cost is low, it is used in most printed circuit boards instead of the other two. The following mentioned holes, without special instructions, are considered as through holes.

From the design point of view, a hole is mainly composed of two parts, one is the middle hole (drill hole), the other is the pad area around the hole, see below. The size of these two parts determines the size of the hole. Clearly, in

high-speed, high-density PCB design, designers always want the holes the smaller the better, so that it can leave more wiring space on the board.

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 2

1.6 PCB capability 2022

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 3