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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

  • Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
  • Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
  • Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
  • Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-452-V6.04
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Board Material: FR-4 Board Thickness: 1.6mm
Surface Cu Thickness: 35 µm Surface Finish: Immersion Gold
Solder Mask: Green Color Of Silkscreen: White
Function: 100% Pass Electrical Test

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

 

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile phone with blind via technology. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

1.2 Features and Benefits

1.2.1 Middle Tg FR-4 Shows low Z-CTE and excellent through hole reliability;

1.2.2 Immersion gold has high solderability, no stressing and less contamination;

1.2.3 Multilayer shortened connection between electronic components;

1.2.4 16000㎡ workshop and 8000 types of PCB's per month;

1.2.5 Delivery on time: >98%

1.2.6 No minimum order quantity. 1 piece is available;

 

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 0

 

1.3 Applications

Industrial Computer

GPS Tracking System

POS Cash Register

Embedded Systems

Data Acquisition System

Microcontrollers

PC and Notebook

 

1.4 Parameter and data sheet

PCB SIZE 119 x 80mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Core FR-4 0.61mm
copper ------- 35um(1oz) MidLayer 1
Prepreg 0.254mm
copper ------- 35um(1oz) MidLayer 2
Core FR-4 0.61mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm /3.5 mm
Number of Different Holes: 9
Number of Drill Holes: 415
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: FR-4 Tg150℃, er<5.4.IT-158, ITEQ
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 1

 

1.5 Composition of Holes

The blind hole is located on the top and bottom surface of the printed circuit board and has a certain depth for the connection between the surface line and the inner line below. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole is a connecting hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.

The above two kinds of holes are located in the inner layer of the circuit board. The formation of through hole process is used before lamination, and several inner layers may be overlapped done during the formation of the through hole.

 

The third is called a through hole, which passes through the entire circuit board. It can be used to interconnect internally or as an installation location hole for components. Because the through hole is easier to realize and the cost is low, it is used in most printed circuit boards instead of the other two. The following mentioned holes, without special instructions, are considered as through holes.

 

From the design point of view, a hole is mainly composed of two parts, one is the middle hole (drill hole), the other is the pad area around the hole, see below. The size of these two parts determines the size of the hole. Clearly, in

high-speed, high-density PCB design, designers always want the holes the smaller the better, so that it can leave more wiring space on the board.

 

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 2

 

1.6 PCB capability 2022

Parameter Value
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board 3

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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