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High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via
  • name
  • name
  • name
  • name

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via

MOQ: 1
Price: USD 2.99-6.99 per piece
Standard Packaging: Vacuum
Delivery Period: 6-7 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0082-V3.3
Number Of Layers:
6
Glass Epoxy:
RO4350B 20mil Mixed With FR-4 0.25mm
Final Foil External:
1oz
Final Height Of PCB:
1.8mm ±10%
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-6.99 per piece
Packaging Details:
Vacuum
Delivery Time:
6-7 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Good day!

 

Today’s topic is 6-layer hybrid PCB on 20mil RO4350B and FR-4. We’ll see 2 boards in the article.

The first board is used in satellite receiver. There’s one RO4350B core on top layer. See the stack-up below. The structure is a little bit complex due to 3 types of blind vias. It's 1.71 mm thick, white silkscreen over green solder mask on both sides and immersion gold is plated on pads and tracks. Entire board is supplied 1 board up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 0

 

Following enlarged picture is viewed from side. 

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 1

 

The second one is used in signal booster. It used two cores of 20mil RO4350B on top side and bottom side. See the stack-up below.

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 2

 

The specifications are as follows:

Base material: RO4350B 20mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L5-L6

Format: 100mm x 120mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm| Inner layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.8 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 3

 

The applications of RO4350B hybrid PCB are wide. For example, LNA, radar data acquisition converter, spread spectrum, 4G antenna, transmitter, radar data acquisition converter, RF switches and splitter module etc.

 

The advantages of RO4350B hybrid PCBs are listed as below,

1) RO4350B exhibits a stable dielectric constant over a broad frequency range;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Strong PCB capability with 8000 types of PCB per month;

5) Qualified ISO9001, ISO14001, IATF16949 and UL certified manufacturing factory;

6) No MOQ, low cost for prototypes and small runs quantity;

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
Our PCB Capability 2022
Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via
  • name
  • name
  • name
  • name
High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via
MOQ: 1
Price: USD 2.99-6.99 per piece
Standard Packaging: Vacuum
Delivery Period: 6-7 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0082-V3.3
Number Of Layers:
6
Glass Epoxy:
RO4350B 20mil Mixed With FR-4 0.25mm
Final Foil External:
1oz
Final Height Of PCB:
1.8mm ±10%
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-6.99 per piece
Packaging Details:
Vacuum
Delivery Time:
6-7 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Good day!

 

Today’s topic is 6-layer hybrid PCB on 20mil RO4350B and FR-4. We’ll see 2 boards in the article.

The first board is used in satellite receiver. There’s one RO4350B core on top layer. See the stack-up below. The structure is a little bit complex due to 3 types of blind vias. It's 1.71 mm thick, white silkscreen over green solder mask on both sides and immersion gold is plated on pads and tracks. Entire board is supplied 1 board up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 0

 

Following enlarged picture is viewed from side. 

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 1

 

The second one is used in signal booster. It used two cores of 20mil RO4350B on top side and bottom side. See the stack-up below.

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 2

 

The specifications are as follows:

Base material: RO4350B 20mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L5-L6

Format: 100mm x 120mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm| Inner layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.8 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 3

 

The applications of RO4350B hybrid PCB are wide. For example, LNA, radar data acquisition converter, spread spectrum, 4G antenna, transmitter, radar data acquisition converter, RF switches and splitter module etc.

 

The advantages of RO4350B hybrid PCBs are listed as below,

1) RO4350B exhibits a stable dielectric constant over a broad frequency range;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Strong PCB capability with 8000 types of PCB per month;

5) Qualified ISO9001, ISO14001, IATF16949 and UL certified manufacturing factory;

6) No MOQ, low cost for prototypes and small runs quantity;

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
Our PCB Capability 2022
Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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