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Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0090-V1.30
Number Of Layers:
1 Layer, 2 Layer, Multilayer, Hybrid Type (Mixed)
Glass Epoxy:
RT/duroid 5870 PCB
Final Foil:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Final Heig1.0-5.0mmht Of PCB:
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Surface Finish:
Bare Copper, HASL, ENIG, Silver, OSP,etc.
Solder Mask Color:
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
50000 pieces per month
Product Description

Hello Everyone,

Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.

 

RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.

 

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 0

 

Let's see the reasons for using RT/duroid 5870 material.

1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.

2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.

3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.

4) Designed for microstrip and stripline application

 

PCB Capability (RT/duroid 5870)

PCB Material: Glass microfiber reinforced PTFE composites
Designator: RT/duroid 5870
Dielectric constant: 2.33 ±0.02 (process)
2.33 (design)
Layer count: 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm)
31mil (0.787mm), 62mil (1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP.
   

 

RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 1

 

The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.

 

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 2

The basic colour of RT/duroid 5870 PCB is black.

 

We specialize in providing you with prototype, small batches and mass production service. If you have any questions, please feel free to contact us.

Thank you for your reading.

 

 

 

 

 

Appendix: Typical Value of RT/duroid 5870

 

Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23 Test at 100 N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80 ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/ 0-100 IPC-TM-650 2.4.41
Td 500 N/A TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A
products
PRODUCTS DETAILS
Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0090-V1.30
Number Of Layers:
1 Layer, 2 Layer, Multilayer, Hybrid Type (Mixed)
Glass Epoxy:
RT/duroid 5870 PCB
Final Foil:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Final Heig1.0-5.0mmht Of PCB:
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Surface Finish:
Bare Copper, HASL, ENIG, Silver, OSP,etc.
Solder Mask Color:
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
50000 pieces per month
Product Description

Hello Everyone,

Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.

 

RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.

 

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 0

 

Let's see the reasons for using RT/duroid 5870 material.

1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.

2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.

3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.

4) Designed for microstrip and stripline application

 

PCB Capability (RT/duroid 5870)

PCB Material: Glass microfiber reinforced PTFE composites
Designator: RT/duroid 5870
Dielectric constant: 2.33 ±0.02 (process)
2.33 (design)
Layer count: 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm)
31mil (0.787mm), 62mil (1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP.
   

 

RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 1

 

The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.

 

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 2

The basic colour of RT/duroid 5870 PCB is black.

 

We specialize in providing you with prototype, small batches and mass production service. If you have any questions, please feel free to contact us.

Thank you for your reading.

 

 

 

 

 

Appendix: Typical Value of RT/duroid 5870

 

Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23 Test at 100 N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80 ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/ 0-100 IPC-TM-650 2.4.41
Td 500 N/A TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A
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