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Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0097-V1.37
Number Of Layers:
2 Layer, Multilayer, Hybrid PCB
Glass Epoxy:
RO3010
Final Height Of PCB:
5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)
Final Foil External:
0.5oz, 1oz, 2oz
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Solder Mask Color:
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000 pieces per month
Product Description

Hello Everyone,

Today we’re talk about RO3010 high frequency PCBs.

 

RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 0

 

More features and applications are as follows:

1, Excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

2, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

3, Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designation: RO3010
Dielectric constant: 10. 2 ±0.3 (process)
11.2 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 5mil (0.127mm), 10mil (0.254mm),
25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

RO3010 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 1

 

Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 2

The basic colour of RO3010 PCB is white.

 

The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market. Should you have any questions, please feel free to contact us.

Thank you for your reading.

 

Appendix: Typical Value of RO3010

Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
13
11
16
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA   ASTM D 3850
Density 2.8   gm/cm3 23 ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
products
PRODUCTS DETAILS
Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-0097-V1.37
Number Of Layers:
2 Layer, Multilayer, Hybrid PCB
Glass Epoxy:
RO3010
Final Height Of PCB:
5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)
Final Foil External:
0.5oz, 1oz, 2oz
Surface Finish:
Bare Copper, HASL, ENIG, OSP Etc..
Solder Mask Color:
Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend:
Green, Black, Blue, Yellow, Red Etc.
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000 pieces per month
Product Description

Hello Everyone,

Today we’re talk about RO3010 high frequency PCBs.

 

RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 0

 

More features and applications are as follows:

1, Excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

2, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

3, Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designation: RO3010
Dielectric constant: 10. 2 ±0.3 (process)
11.2 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 5mil (0.127mm), 10mil (0.254mm),
25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

RO3010 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 1

 

Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

Rogers RO3010 High Frequency Printed Circuit Board PCB Rogers DK10.2 Antenna PCB 2

The basic colour of RO3010 PCB is white.

 

The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market. Should you have any questions, please feel free to contact us.

Thank you for your reading.

 

Appendix: Typical Value of RO3010

Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
13
11
16
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA   ASTM D 3850
Density 2.8   gm/cm3 23 ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
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