RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||China|
|Brand Name:||Bicheng Technologies Limited|
|Minimum Order Quantity:||1|
|Delivery Time:||10 working days|
|Supply Ability:||50000 pieces per month|
|Number Of Layers:||1 Layer, 2 Layer, Multilayer, Hybrid Type (Mixed)||Glass Epoxy:||RO4350B Rogers|
|Final Foil:||0.5oz (17 µm), 1oz (35µm), 2oz (70µm)||Final Height Of PCB:||10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)|
|Surface Finish:||Bare Copper, HASL, ENIG, Silver, OSP,etc.||Solder Mask Color:||Green, Black, Blue, Yellow, Red Etc.|
|Colour Of Component Legend:||Green, Black, Blue, Yellow, Red Etc.||Test:||100% Electrical Test Prior Shipment|
Today, we’re going to introduce high frequency PCB built on RO4350B laminates.
RO4350B is a woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate from Rogers Corporation, which has very similar electrical properties to PTFE/fabric glass cloth material and its processability is similar to epoxy resin/glass cloth material.
The Reason for using RO4350B Laminates
1. Superior high frequency performance
RO4350B materials are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.
2. Low dielectric loss
Low loss results in excellent electrical performance and allows applications with high operating frequencies.
3. Stable electrical properties versus frequency
RO4350B material possesses the properties of RF microwave circuits, matching networks and controlled impedance transmission lines.
4. Low thermal coefficient of dielectric constant
This allows the RO4350B to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer PCBs constructions and reliable plated through holes.
RO4350B laminates can be fabricated using standard FR-4 processes, do not require speicalized via preparation prcoesses, can be processed by automated handling systems and scrubbing equipment used for copper surface preparation. This properties allow it can be using in volume manufacturing and get competitively priced.
Double sided circuit boards on RO4350B are available in a variety of thicknesses, such as 10mil, 20mil, 30mil and 60mil. It's used in a variety of typical and non-traditional microwave / radio frequency applications, such as base station antennas, attenuator, power amplifiers, RFID, radar and sensors etc.
|PCB Material:||Glass reinforced hydrocarbon ceramic laminates|
|Dielectric constant:||3.48 ±0.05 (process)|
|Layer count:||1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)|
|Copper weight:||0.5oz (17 µm), 1oz (35µm), 2oz (70µm)|
|PCB thickness:||10mil (0.254mm), 20mil (0.508mm)|
|30mil (0.762mm), 60mil (1.524mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Bare copper, HASL, ENIG, Silver, OSP,etc.|
The multilayer PCB of RO4350B is mostly four-layer, six-layer and eight-layer, and some are designed as three-layer (false four-layer), five-layer (false six-layer) and so on.
In order to save production cost without reducing signal loss in high frequency environment, FR-4 glass fiber material is mixed with RO4350B in multi-layer circuit board. The high frequency material is used in signal layer and FR-4 glass fiber material is used in other layers.
The basic colour of RO4350B PCB is white.
We specialize in provide you with prototype, small batches and mass production service.
If you have any requirements on this kind of PCB, please feel free to contact us.
Thank you for your reading.
Appendix: Typical Properties of RO4350B
|Dielectric Constant,εProcess||3.48±0.05||Z||10 GHz/23℃||IPC-TM-650 184.108.40.206 Clamped Stripline|
|Dielectric Constant,εDesign||3.66||Z||8 to 40 GHz||Differential Phase Length Method|
|Thermal Coefficient of ε||+50||Z||ppm/℃||-50℃to 150℃||IPC-TM-650 220.127.116.11|
|Volume Resistivity||1.2 x 1010||MΩ.cm||COND A||IPC-TM-650 18.104.22.168|
|Surface Resistivity||5.7 x109||MΩ||COND A||IPC-TM-650 22.214.171.124|
|Electrical Strength||31.2(780)||Z||Kv/mm(v/mil)||0.51mm(0.020")||IPC-TM-650 126.96.36.199|
|MPa(ksi)||RT||ASTM D 638|
|MPa(ksi)||RT||ASTM D 638|
|after etch+E2/150℃||IPC-TM-650 2.4.39A|
|Coefficient of Thermal Expansion||10
|Tg||>280||℃ TMA||A||IPC-TM-650 188.8.131.52|
|Td||390||℃ TGA||ASTM D 3850|
|Thermal Conductivity||0.69||W/M/oK||80℃||ASTM C518|
|Moisture Absorption||0.06||%||48hrs immersion 0.060"
sample Temperature 50℃
|ASTM D 570|
|Density||1.86||gm/cm3||23℃||ASTM D 792|
|Copper Peel Stength||0.88
|after solder float 1 oz.
|Lead-free Process Compatible||Yes|
Contact Person: Mr. Kevin Liao