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Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

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Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

Name: Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB
Brand: Bicheng Technologies Limited
SKU: BIC-500-V0.13
Price: 2.99 USD
Availability: InStock
Rating: 4.5 (198 reviews)

MOQ:	1
Price:	USD 2.99-8.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Technologies Limited

Certification

Model Number

BIC-500-V0.13

Number Of Layers:

Glass Epoxy:

TU-872 SKL Sp

Final Foil:

1.5 Oz

Final Height Of PCB:

1.6 Mm ±10%

Surface Finish:

Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)

Solder Mask Color:

Blue

Colour Of Component Legend:

White

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-8.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB 0

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material:	High performance modified epoxy FR-4 resin
Designation:	TU-872 SLK Sp
Dielectric constant:	< 3.5
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:	10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

Typical Properties (TU-872 SLK Sp)

	Typical Values	Conditioning	IPC-4101 /126
Thermal
Tg (DMA)	220°C
Tg (DSC)	200°C		> 170°C
Tg (TMA)	190°C	E-2/105
Td (TGA)	340°C		> 340°C
CTE x-axis	12~15 ppm/°C		N/A
CTE y-axis	12~15 ppm/°C	E-2/105	N/A
CTE z-axis	2.30%		< 3.0%
Thermal Stress,Solder Float, 288°C	> 60 sec	A	> 10 sec
T260	60 min		> 30 min
T288	20 min	E-2/105	> 15 min
T300	5 min		> 2 min
Flammability	94V-0	E-24/125	94V-0
DK & DF
Permittivity (RC 50%) @10GHz	3.5
Loss Tangent (RC 50%) @10GHz	0.008
Electrical
Permittivity (RC50%)
1GHz (SPC method/4291B)	3.6/3.4		< 5.2
5GHz (SPC method)	3.5	E-2/105	-
10GHz (SPC method)	3.5		-
Loss Tangent (RC50%)
1GHz (SPC method/4291B)	0.006/0.004
5GHz (SPC method)	0.007	E-2/105	< 0.035
10GHz (SPC method)	0.008
Volume Resistivity	> 1010 MΩ•cm	C-96/35/90	> 106 MΩ•cm
Surface Resistivity	> 108 MΩ	C-96/35/90	> 104 MΩ
Electric Strength	> 40 KV/mm	A	> 30 kV/mm
Dielectric Breakdown	> 50 kV	A	N/A
Mechanical
Young’s Modulus
Warp Direction	26 GPa	A	N/A
Fill Direction	24 GPa
Flexural Strength
Lengthwise	> 60,000 psi	A	> 60,000 psi
Crosswise	> 50,000 psi	A	> 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil	4~7 lb/in	A	> 4 lb/in
Water Absorption	0.13%	E-1/105+D-24/23	< 0.5 %

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