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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

Minimum Order Quantity : 1 Price : USD 2.99-9.99 PER PIECE
Packaging Details : Vacuum Delivery Time : 10 working days
Payment Terms : T/T, Western Union Supply Ability : 45000 pieces per month
Place of Origin: China Brand Name: Bicheng Technologies Limited
Certification: UL Model Number: BIC-504-V0.54

Detail Information

Number Of Layers: 4 Glass Epoxy: S1000-2M
Final Foil: 1 Oz Final Height Of PCB: 1.6 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Gloss Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Product Description

High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
General Description
S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.

 


Features
Lead-free compatible FR-4 laminate
Tg170℃ (DSC), UV Blocking/AOI compatible
High heat resistance
Lower Z-axis CTE
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption
Excellent mechanical processability
 
High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
 
 
Applications
Computer
Communication
Automotive electronics
Suitable for high layer count PCB
 


Our PCB Capability (S1000-2M)

PCB Material: High Tg, High Performance and Low CTE Epoxy Resin
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 
 High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
General Properties of S1000-2M

Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA 185
IPC-TM-650 2.4.25D DSC 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3

 
High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

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