products
PRODUCTS DETAILS
Home > Products >
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
Contact Us
Contact Now
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • name
  • name
  • name
  • name
  • name

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-502-V0.55
Number Of Layers:
4
Glass Epoxy:
TU-768
Final Foil:
1.5 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL LF
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

PCB Material: High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %
 
 
 
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 2
 
Tags: 

pcb led board,  

aluminum pcb,  

aluminium pcb

Recommended Products
Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

Contact Now
High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes

High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes

Contact Now
Thin PCB 0.2mm FR-4 Printed Circuit Board with White Solder Mask and OSP

Thin PCB 0.2mm FR-4 Printed Circuit Board with White Solder Mask and OSP

Contact Now
Multi-layer Thin PCB 0.5mm 4-Layer Thin PCB Board With Immersion Gold

Multi-layer Thin PCB 0.5mm 4-Layer Thin PCB Board With Immersion Gold

Contact Now
Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Contact Now
Thick PCB 2.4mm Circuit Board Dual Layer PCB Board Built on FR-4 With 2oz Copper

Thick PCB 2.4mm Circuit Board Dual Layer PCB Board Built on FR-4 With 2oz Copper

Contact Now
Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Contact Now
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold

Contact Now
PCB Spacer FR-4 Spacer Block Space Bar On 1.5mm FR4 with Drill Holes

PCB Spacer FR-4 Spacer Block Space Bar On 1.5mm FR4 with Drill Holes

Contact Now
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

Contact Now
Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

Contact Now
products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • name
  • name
  • name
  • name
  • name
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
MOQ: 1
Price: USD 2.99-9.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-502-V0.55
Number Of Layers:
4
Glass Epoxy:
TU-768
Final Foil:
1.5 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
HASL LF
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-9.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

PCB Material: High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %
 
 
 
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 2
 
Tags: 

pcb led board,

aluminum pcb,

aluminium pcb

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
Sitemap |  Privacy Policy | China Good Quality Newly Shipped RF PCB Supplier. Copyright © 2016-2024 Shenzhen Bicheng Electronics Technology Co., Ltd . All Rights Reserved.