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Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin

MOQ: 1 piece
Price: USD 9.99-99.99
Standard Packaging: 12kg per carton, 31*27*20cm
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-189-V2.0
Base Material:
RO4535
Tg:
288
Layer Count:
2 Layers
Solder Mask:
Green
Surface Finish:
Immersion Gold
PCB Thickness:
0.6mm
Copper Weight:
1oz
Minimum Order Quantity:
1 piece
Price:
USD 9.99-99.99
Packaging Details:
12kg per carton, 31*27*20cm
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Highlight:

high frequency circuit design

,

high speed pcb

Product Description

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

 

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin 0

 

Features and Benefits

1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

Our PCB Capability (RO4535)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4535
Dielectric constant: 3.44
Dissipation Factor 0.0037 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RO4535 Typical Values

Property RO4535 Direction Units Condition Test Method
Dielectric Constant, er Process 3.44 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0032 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0037 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.5 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 16 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
17 Y
50 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.09 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.9 - gm/cm3 - ASTM D792
Copper Peel Strength 5.1 (0.9) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability V-0 - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin 1

 

products
PRODUCTS DETAILS
Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin
MOQ: 1 piece
Price: USD 9.99-99.99
Standard Packaging: 12kg per carton, 31*27*20cm
Delivery Period: 10 working days
Payment Method: T/T
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-189-V2.0
Base Material:
RO4535
Tg:
288
Layer Count:
2 Layers
Solder Mask:
Green
Surface Finish:
Immersion Gold
PCB Thickness:
0.6mm
Copper Weight:
1oz
Minimum Order Quantity:
1 piece
Price:
USD 9.99-99.99
Packaging Details:
12kg per carton, 31*27*20cm
Delivery Time:
10 working days
Payment Terms:
T/T
Supply Ability:
50000 pieces per month
Highlight

high frequency circuit design

,

high speed pcb

Product Description

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

 

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin 0

 

Features and Benefits

1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

Our PCB Capability (RO4535)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4535
Dielectric constant: 3.44
Dissipation Factor 0.0037 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RO4535 Typical Values

Property RO4535 Direction Units Condition Test Method
Dielectric Constant, er Process 3.44 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0032 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0037 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.5 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 16 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
17 Y
50 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.09 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.9 - gm/cm3 - ASTM D792
Copper Peel Strength 5.1 (0.9) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability V-0 - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna PCB with Immersion Gold, Silver, Tin 1

 

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