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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB

Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB

  • Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB
  • Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB
Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0060-V2
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 50000 pieces per month
Contact Now
Detailed Product Description
Glass Epoxy: RO4730G3, RogersCorp Final Height Of PCB: 1.6mm ± 10%
Final Foil External: 1 Oz Surface Finish: Immersion Gold (51.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color: Green Colour Of Component Legend: White
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB
 
Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.
 
RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.
 
Typical application is cellular base station antennas.
 
General description
This is a type of double sided RF PCB built on 1.524mm (60mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.
 
Basic specifications
Base material: RO4730G3 60mil (1.524mm)
Dielectric constant: 3.0+/-0.05
Layer count: 2 layers
Type: Through holes
Format: 110mm x 95mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.6 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months

 
Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB 0
 
Data Sheet of RO4730G3
RO4730G3 Typical Value
PropertyRO4730G3DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.5Z 10 GHz 23℃IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign2.98Z 1.7 GHz to 5 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0028Z 10 GHz 23℃IPC-TM-650 2.5.5.5
 2.5 GHz
Thermal Coefficient of ε+34Zppm/℃-50 ℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability<0.4X, Ymm/mafter etech +E2/150 ℃IPC-TM-650 2.4.39A
Volume Resistivity (0.030")9 X 107 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity (0.030")7.2 X 105 COND AIPC-TM-650 2.5.17.1
PIM-165 dBc50 ohm 0.060"43 dBm 1900 MHz
Electrical Strength (0.030")730ZV/mil IPC-TM-650 2.5.6.2
Flexural Strength MD181 (26.3) Mpa (kpsi)RTASTM D790
CMD139 (20.2) 
Moisure Absorption0.093-%48/50IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity0.45ZW/mK50℃ASTM D5470
Coefficient of Thermal Expansion15.9
14.4
35.2
X
Y
Z
ppm/℃-50 ℃to 288℃IPC-TM-650 2.4.4.1
Tg>280  IPC-TM-650 2.4.24
Td411  ASTM D3850
Density1.58 gm/cm3 ASTM D792
Copper Peel Stength4.1 pli1oz,LoPro EDCIPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    
 
 
Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB 1
 
Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB 2
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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