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F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
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F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
  • name
  • name

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Payapl
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-170-V1.7
Number Of Layers:
2
Glass Epoxy:
PTFE
Final Height Of PCB:
6.0mm ±0.1
Final Foil External:
1 Oz
Surface Finish:
Immersion Tin
Solder Mask Color:
No
Colour Of Component Legend:
No
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Payapl
Supply Ability:
50000 pieces per month
Product Description

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.

 

Typical Properties (F4BTM-1/2)

Appearance It complies with the national military standard regulations of microwave printed circuit substrate materials
Part No. F4BTM-1/2 (255) F4BTM-1/2 (265) F4BTM-1/2 (285) F4BTM-1/2 (294) F4BTM-1/2 (300) F4BTM-1/2 (320)
F4BTM-1/2 (338) F4BTM-1/2 (350) F4BTM-1/2 (400) F4BTM-1/2 (440) F4BTM-1/2 (615) F4BTM-1/2 (1020)
Sheet Size(mm) 610 x 460 600 x 500 1220 x 914 1220 x 1000 1500 x 1000  
Dielectric Thickness(mm) 0.254 ±0.025 0.508 ±0.05 0.762 ±0.05 0.787 ±0.05 1.016 ±0.05 1.27 ±0.05
1.524 ±0.05 2.0 ±0.075 3.0 ±0.09 4.0 ±0.1 5.0 ±0.1 6.0 ±0.12
9.0 ±0.18 10.0 ±0.18 12.0 ±0.2      
Exfoliation strength of copper foil Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm
Thermal Stress Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble.
Chemical Properties According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment.
Physical and electrical performance Property Test Condition Unit Value
Density Normal g/cm³ 2.1-3.0
Water Absorption Dip in 20℃±2℃ distilled water for 24 hours % ≦0.05
Operation Temperature High and low temperature box ℃ -50~+260
Coefficient of thermal conductivity   W/(m·K) 0.6 - 0.9
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 2.55~3.0) ppm/℃ x 15
y 15
z 65
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 3.2~3.5) ppm/℃ x 15
y 15
z 55
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 4.0~10.2) ppm/℃ x 12
y 14
z 50
Shrinkage Factor Cook in boiling water for 2 hours % <0.0002
Surface Resistivity 500V DC Normal State M.Ω ≧1 x 106
Constant heat and humidity ≧1 x 105
Volume Resistivity Normal State MΩ.cm ≧1 x 107
Constant Heat and Humidity ≧1 x 106
Surface Electrical Resistance Strength Normal State δ=1mm(Kv/mm) ≧1.2
Constant Heat and Humidity ≧1.1
Dielectric Constant 10GHz εr 2.85 ±0.05 2.94 ±0.05 2.55 ±0.05
3.00 ±0.05 3.20 ±0.05 2.65 ±0.05
3.38 ±0.05 3.50 ±0.05  
4.00 ±0.08 4.40 ±0.1  
6.15 ±0.15 10.2 ±0.25  
Temperature Coefficient of Dielectric Constant Dielectric Constant Value
2.55 2.65 -90
2.85 2.94 -85
3.0 3.2 -75
3.38 -65
3.5 4.0 4.4 -60
6.15 -55
10.2 -50
Dissipation Factor 10 GHz tgδ 2.55-3.0 ≦1.5 x 10-3
tgδ 3.0-3.5 ≦2.0 x 10-2
tgδ 4.0-10.2 ≦2.5 x 10-2
Flame Retardant Resistance UL94 V-0

 

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin 0

 

Our PCB Capability(F4BTM-1/2)

PCB Material: Fibre glass coated PTFE
Code: F4BTM-1/2 (family series)
Dielectric constant: 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2
Layer count: 1 Layer, 2 Layers and multi-layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersin Tin, OSP,etc.

 

High Frequency Materials

Rogers RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3035, RO3006, RO3010, RO3210, RO3203, etc.

Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC etc.

Rogers TMM4, TMM10, Kappa 438 etc.

PTFE F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)

Taconic TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-5, TLY-3, RF-35, RF-35TC, TLF-35, RF-60A, RF-60TC, RF-35A2,RF-45, TRF-45 etc.

AD450, AD600, AD1000, TC350 etc.

 

 

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin 1

 
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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

F4B SERIES PCBS
F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
  • name
  • name
F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Payapl
Supply Capacity: 50000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-170-V1.7
Number Of Layers:
2
Glass Epoxy:
PTFE
Final Height Of PCB:
6.0mm ±0.1
Final Foil External:
1 Oz
Surface Finish:
Immersion Tin
Solder Mask Color:
No
Colour Of Component Legend:
No
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Payapl
Supply Ability:
50000 pieces per month
Product Description

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.

 

Typical Properties (F4BTM-1/2)

Appearance It complies with the national military standard regulations of microwave printed circuit substrate materials
Part No. F4BTM-1/2 (255) F4BTM-1/2 (265) F4BTM-1/2 (285) F4BTM-1/2 (294) F4BTM-1/2 (300) F4BTM-1/2 (320)
F4BTM-1/2 (338) F4BTM-1/2 (350) F4BTM-1/2 (400) F4BTM-1/2 (440) F4BTM-1/2 (615) F4BTM-1/2 (1020)
Sheet Size(mm) 610 x 460 600 x 500 1220 x 914 1220 x 1000 1500 x 1000  
Dielectric Thickness(mm) 0.254 ±0.025 0.508 ±0.05 0.762 ±0.05 0.787 ±0.05 1.016 ±0.05 1.27 ±0.05
1.524 ±0.05 2.0 ±0.075 3.0 ±0.09 4.0 ±0.1 5.0 ±0.1 6.0 ±0.12
9.0 ±0.18 10.0 ±0.18 12.0 ±0.2      
Exfoliation strength of copper foil Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm
Thermal Stress Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble.
Chemical Properties According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment.
Physical and electrical performance Property Test Condition Unit Value
Density Normal g/cm³ 2.1-3.0
Water Absorption Dip in 20℃±2℃ distilled water for 24 hours % ≦0.05
Operation Temperature High and low temperature box ℃ -50~+260
Coefficient of thermal conductivity   W/(m·K) 0.6 - 0.9
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 2.55~3.0) ppm/℃ x 15
y 15
z 65
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 3.2~3.5) ppm/℃ x 15
y 15
z 55
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 4.0~10.2) ppm/℃ x 12
y 14
z 50
Shrinkage Factor Cook in boiling water for 2 hours % <0.0002
Surface Resistivity 500V DC Normal State M.Ω ≧1 x 106
Constant heat and humidity ≧1 x 105
Volume Resistivity Normal State MΩ.cm ≧1 x 107
Constant Heat and Humidity ≧1 x 106
Surface Electrical Resistance Strength Normal State δ=1mm(Kv/mm) ≧1.2
Constant Heat and Humidity ≧1.1
Dielectric Constant 10GHz εr 2.85 ±0.05 2.94 ±0.05 2.55 ±0.05
3.00 ±0.05 3.20 ±0.05 2.65 ±0.05
3.38 ±0.05 3.50 ±0.05  
4.00 ±0.08 4.40 ±0.1  
6.15 ±0.15 10.2 ±0.25  
Temperature Coefficient of Dielectric Constant Dielectric Constant Value
2.55 2.65 -90
2.85 2.94 -85
3.0 3.2 -75
3.38 -65
3.5 4.0 4.4 -60
6.15 -55
10.2 -50
Dissipation Factor 10 GHz tgδ 2.55-3.0 ≦1.5 x 10-3
tgδ 3.0-3.5 ≦2.0 x 10-2
tgδ 4.0-10.2 ≦2.5 x 10-2
Flame Retardant Resistance UL94 V-0

 

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin 0

 

Our PCB Capability(F4BTM-1/2)

PCB Material: Fibre glass coated PTFE
Code: F4BTM-1/2 (family series)
Dielectric constant: 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2
Layer count: 1 Layer, 2 Layers and multi-layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersin Tin, OSP,etc.

 

High Frequency Materials

Rogers RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3035, RO3006, RO3010, RO3210, RO3203, etc.

Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC etc.

Rogers TMM4, TMM10, Kappa 438 etc.

PTFE F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)

Taconic TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-5, TLY-3, RF-35, RF-35TC, TLF-35, RF-60A, RF-60TC, RF-35A2,RF-45, TRF-45 etc.

AD450, AD600, AD1000, TC350 etc.

 

 

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin 1

 
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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