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Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar

Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 500000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-119-V1.0
Number Of Layers:
2
Glass Epoxy:
RO4360G2
Final Foil:
1.0 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
No
Colour Of Component Legend:
No
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
500000 pieces per month
Product Description

Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.
 
RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.
 
RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.
Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,
 
2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible
 
3. Environmentally friendly
1.) Lead free process compatible
 
4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain
 
 
Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 0
 
PCB Capability (RO4360G2)

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 
Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/℃ -50 ℃to 288℃ After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃ Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃ to 150 ℃ IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765
 
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 1
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 2
 
products
PRODUCTS DETAILS
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 500000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-119-V1.0
Number Of Layers:
2
Glass Epoxy:
RO4360G2
Final Foil:
1.0 Oz
Final Height Of PCB:
1.6 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
No
Colour Of Component Legend:
No
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
500000 pieces per month
Product Description

Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.
 
RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.
 
RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.
Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,
 
2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible
 
3. Environmentally friendly
1.) Lead free process compatible
 
4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain
 
 
Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 0
 
PCB Capability (RO4360G2)

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 
Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
2.5 GHz/23℃
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50℃ ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/℃ -50 ℃to 288℃ After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125℃ Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50℃/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50℃ to 150 ℃ IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765
 
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 1
 
Rogers RO4360 High Frequency PCB 60mil Double Sided Radio Frequency Circuit With Immersion Gold for Ground-based Radar 2
 
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