Wangling TFA294 middle DK 2.94 High-Frequency Laminate and Custom double side 35umm copper PCB it can be paired with 50Ω embedded resistor copper foil

Product Description

For aerospace-grade microwave and millimeter-wave applications, material reliability and electrical stability are paramount. Wangling's TFA294 high-frequency laminate is a PTFE-ceramic composite dielectric substrate engineered to deliver outstanding electrical, thermal, and mechanical performance—positioning it as a domestic alternative to comparable imported materials.

Unlike conventional glass-reinforced laminates, the TFA series does not use glass fiber cloth impregnated with resin to form prepreg sheets. Instead, a specialized new process creates prefabricated sheets that are pressed using a unique lamination technique. The dielectric layer consists of PTFE resin combined with a large amount of uniformly distributed special nano-ceramics, eliminating the fiberglass effect during electromagnetic wave propagation. This results in excellent frequency stability, the lowest dielectric loss at its class level, minimized X/Y/Z anisotropy, and a low thermal expansion coefficient equivalent to copper foil.

The TFA series offers four dielectric constant options: 2.94 (TFA294), 3.0 (TFA300), 6.15 (TFA615), and 10.2 (TFA1020). The material comes standard with RTF low-roughness copper foil to reduce conductor loss while maintaining excellent peel strength. Rolled copper foil, copper-based, or aluminum-based configurations are also available. TFA294 and TFA300 can be paired with 50Ω embedded resistor copper foil to form resistive film laminates.

Key Properties at a Glance:

Applications

TFA294 laminates are well suited to a broad range of high-reliability, high-frequency applications, including:

- Aerospace equipment, space, in-cabin equipment, aircraft;
- Microwaves, antennas, phase-sensitive antennas;
- Early warning radars, airborne radars, etc.;
- Phased array antennas, beamforming networks;
- Satellite communications, navigation;
- Power amplifiers.

Custom PCB Manufacturing on TFA294

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Wangling TFA294 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

Material Advantages

Precisely Controlled Dielectric Constant:
TFA294 offers a dielectric constant of 2.94 with a tight tolerance of ±0.04 at 10 GHz. The dielectric constant is precisely calibrated by adjusting the ratio of nano-ceramics to PTFE resin, ensuring excellent batch-to-batch consistency and repeatable circuit performance.

Ultra-Low Dielectric Loss:
With a dissipation factor of just 0.0010 at 10 GHz and 20 GHz (0.0012 at 40 GHz), TFA294 minimizes signal attenuation in transmission lines. This ultra-low loss ensures excellent high-frequency performance across microwave and millimeter-wave bands.

No Fiberglass Effect:
The TFA series contains no glass fiber cloth. Instead, uniformly distributed special nano-ceramics are mixed with the resin, eliminating the fiberglass effect that can cause variations in dielectric constant. The result is excellent frequency stability and minimal X/Y/Z anisotropy.

Exceptional Frequency Stability:
Stripline testing shows stable dielectric constant and loss from 0.5 GHz to 40 GHz, with ultra-low loss values maintained throughout. Due to the frequency limitations of the stripline test method, the material's usable frequency extends to 77 GHz and even higher.

Exceptional Temperature Stability:
The thermal coefficient of Dk is just -5 ppm/°C over the range of -55°C to +150°C, ensuring minimal variation in electrical performance across temperature extremes. The material can be used continuously from -55°C to +260°C, far exceeding the tested range.

CTE Matched to Copper:
With X/Y CTE values of 18 ppm/°C and Z-axis CTE of 32 ppm/°C, TFA294 provides excellent dimensional stability and ensures the reliability of plated through-holes even under thermal cycling.

Radiation Resistance and Low Outgassing:
The material exhibits excellent radiation resistance, maintaining stable dielectric and physical properties after radiation exposure. Low outgassing performance complies with vacuum outgassing requirements for aerospace applications.

Low Moisture Absorption:
With moisture absorption of only 0.03%, TFA294 maintains stable electrical properties even in humid environments, an essential attribute for outdoor and aerospace applications.

Excellent Processability:
The material can be processed using standard PTFE PCB fabrication techniques. Its excellent mechanical and physical properties make it suitable for multilayer, high-layer-count, and backplane processing, while also performing well in high-density hole and fine-line processing.

Resistor Foil Option:
TFA294 can be paired with 50Ω embedded resistor copper foil, where the resistive film is a nickel-phosphorus alloy with a thickness of 0.2 μm and a sheet resistance of 50 ± 5 Ω per square centimeter.

Metal Base Options:
TFA294 is available with copper-based (TFA294-CU) or aluminum-based (TFA294-AL) configurations, where one side of the dielectric layer is clad with copper foil and the other side is bonded to a copper or aluminum plate for shielding or heat dissipation.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and aerospace-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

Standard panel sizes include 305×460mm (12"×18") and 460×610mm (18"×24"), with custom sizes available upon request. Dielectric thicknesses start from 0.127mm (5 mil) and are available in multiples of 0.127mm, with custom thicknesses available.

For inquiries about custom stack-ups, panel sizes, alternative copper foils (RTF, rolled copper, resistor foil), copper- or aluminum-based configurations, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.