Rogers TMM10i high Dk 9.80 Thermoset Microwave Laminate and Custom 75mil material double side copper PCB with Immersion gold for RF and microwave circuitry

Product Description

For RF and microwave designers seeking a high-dielectric-constant material with isotropic electrical properties and the processing ease of a soft substrate, Rogers TMM10i thermoset microwave laminate is an exceptional choice. TMM10i is a ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability in stripline and microstrip applications.

Like other materials in the TMM series, TMM10i combines many desirable features of ceramic and PTFE substrates with the ease of soft substrate processing techniques—without requiring specialized production methods. The material does not require sodium naphthalate treatment prior to electroless plating, and all common PWB processes can be used in production. TMM10i laminates are available clad with ½ oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates, with substrate thicknesses from 0.015" to 0.500".

Key Properties at a Glance:

Applications

TMM10i laminates are well suited to a broad range of RF and microwave applications, including:

1. RF and Microwave Circuitry – Stripline and microstrip designs requiring high Dk
2. Power Amplifiers and Combiners – Effective heat removal due to high thermal conductivity
3. Filters and Couplers – Stable Dk for consistent frequency response
4. Satellite Communication Systems – Reliable performance in demanding environments
5. GPS Antennas – Dimensionally stable for precise positioning
6. Patch Antennas – High Dk enables compact designs
7. Dielectric Polarizers and Lenses – Isotropic Dk for precision RF components
8. Chip Testers – Mechanical stability under repeated use

Custom PCB Manufacturing on TMM10i

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers TMM10i and other advanced materials. The following specification details a representative double-sided rigid PCB implementation:

PCB Construction Details:

Material Advantages

High Isotropic Dielectric Constant:
TMM10i offers a design Dk of 9.9—significantly higher than standard PTFE-based laminates. The isotropic dielectric constant ensures consistent electrical performance regardless of orientation, making it ideal for compact patch antennas, filters, and dielectric lenses where physical size reduction is critical. With a Dk nearly three times that of PTFE materials, circuit dimensions can be substantially reduced.

Exceptional Thermal Stability:
The thermal coefficient of Dk is exceptionally low at -43 ppm/°K, ensuring stable electrical performance across temperature extremes. The isotropic CTE (19/19/20 ppm/°K for X/Y/Z) is very closely matched to copper, enabling high-reliability plated through-holes even in thick substrates.

Thermoset Resin System:
Unlike thermoplastic materials, TMM10i does not soften when heated. This allows wire bonding of component leads to circuit traces without concerns of pad lifting or substrate deformation. The thermoset nature also provides mechanical properties that resist creep and cold flow.

Enhanced Thermal Conductivity:
At 0.76 W/m·K, TMM10i offers approximately twice the thermal conductivity of traditional PTFE/ceramic laminates, facilitating heat removal in power amplifier and high-density applications.

Process Chemical Resistance:
The base substrate is resistant to etchants and solvents used in printed circuit production, reducing damage to the material during fabrication and assembly processes. No sodium naphthalate treatment is required prior to electroless plating.

Ceramic-Like Performance, Soft Substrate Processing:
TMM10i combines many desirable features of ceramic substrates with the ease of soft substrate processing techniques. TMM10 and TMM10i laminates can replace alumina substrates in many applications, offering significant processing advantages.

Low Etch Shrinkage:
The material exhibits low etch shrinkage values, contributing to precise feature definition and repeatable circuit performance.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils, brass or aluminum plate bonding, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.