Rogers TMM6 DK 6.0 Thermoset Microwave Laminate combine of ceramic and PTFE and Custom 75mil Double-sided PCB with ENIG finish

Product Description

In RF and microwave circuit design, engineers often face a trade-off between the processing convenience of soft substrates and the electrical performance of ceramic materials. Rogers TMM6 thermoset microwave laminate bridges this gap—a ceramic, hydrocarbon, thermoset polymer composite that combines many benefits of both ceramic and traditional PTFE laminates without requiring the specialized production techniques common to those materials.

TMM6 laminates are designed for high plated-through-hole reliability in stripline and microstrip applications. They do not require sodium naphthalate treatment prior to electroless plating, and all common PWB processes can be used in production. The material is available clad with ½ oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates, with substrate thicknesses from 0.015" to 0.500".

Key Properties at a Glance:

Applications

TMM6 laminates are well suited to a broad range of RF and microwave applications, including:

- RF and microwave circuitry

- Power amplifiers and combiners

- Filters and coupler

- Satellite communication systems

- Global Positioning Systems Antennas

- Patch Antennas

- Dielectric polarizers and lenses

- Chip testers

Custom PCB Manufacturing on TMM6

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers TMM6 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

Material Advantages

Unique Dielectric Constant:
With a design Dk of 6.3, TMM6 offers a distinctly higher dielectric constant than many PTFE-based laminates. This enables circuit miniaturization—particularly valuable for patch antennas, filters, and dielectric lenses where physical size reduction is critical.

Exceptional Thermal Stability:
The thermal coefficient of Dk is exceptionally low at -11 ppm/°K, ensuring stable electrical performance across temperature extremes. The isotropic CTE (18/18/26 ppm/°K for X/Y/Z) is very closely matched to copper, enabling high-reliability plated through-holes even in thick substrates.

Thermoset Resin System:
Unlike thermoplastic materials, TMM6 does not soften when heated. This allows wire bonding of component leads to circuit traces without concerns of pad lifting or substrate deformation. The thermoset nature also provides mechanical properties that resist creep and cold flow.

Enhanced Thermal Conductivity:
At 0.72 W/m·K, TMM6 offers approximately twice the thermal conductivity of traditional PTFE/ceramic laminates, facilitating heat removal in power amplifier and high-density applications.

Process Chemical Resistance:
The base substrate is resistant to etchants and solvents used in printed circuit production, reducing damage to the material during fabrication and assembly processes. No sodium naphthalate treatment is required prior to electroless plating.

Ceramic-Like Performance, Soft Substrate Processing:
TMM6 combines many desirable features of ceramic substrates with the ease of soft substrate processing techniques. TMM10 and TMM10i laminates can replace alumina substrates in many applications.

Low Etch Shrinkage:
The material exhibits low etch shrinkage values, contributing to precise feature definition and repeatable circuit performance.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils, brass or aluminum plate bonding, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.