F4BME245 PTFE Fiberglass Laminate with Reverse-Treated Copper 4mil double side material and Ultra-Thin PCB Solutions witn Immersion gold

Product Description

When a design calls for the low PIM performance of reverse-treated copper foil, the low loss of a PTFE-based dielectric, and a dielectric constant in the 2.4–2.5 range, the F4BME245 from Taizhou Wangling Insulation Materials Factory delivers a well-balanced solution. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, this laminate offers superior, consistent electrical properties and serves as a reliable, high-performance domestic substitute for comparable imported materials.

The F4BM and F4BME series share the same dielectric layer but differ in their copper foil. F4BM is paired with ED copper foil, making it suitable for applications without strict PIM requirements. F4BME is paired with reverse-treated RTF copper foil, delivering excellent PIM performance, more precise line control, and lower conductor loss. In both series, the dielectric constant is precisely tuned by adjusting the ratio between PTFE and glass fiber cloth—achieving low loss while enhancing dimensional stability.

Key Properties at a Glance (F4BME245):

Note: F4BME245 offers a Dk range of 2.17 to 3.0, with customizable values. When Dk ≤ 2.65, the minimum available dielectric thickness is 0.1mm; when Dk is 2.7–3.0, the minimum dielectric thickness is 0.2mm.

Applications

F4BME245 is well suited to a broad range of RF, microwave, and antenna applications, including:

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

Custom PCB Manufacturing on F4BME245

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using F4BME245 and other advanced materials. The following specification details a representative 2-layer ultra-thin RF PCB implementation:

PCB Construction Details:

Low and Tightly Controlled Dielectric Constant:
With a Dk of 2.45 ± 0.05 at 10 GHz, F4BME245 provides tight impedance control and repeatable circuit performance. The material is available in a Dk range from 2.17 to 3.0, with custom values available to suit specific design requirements.

Low Dielectric Loss:
A dissipation factor of 0.0012 at 10 GHz and 0.0017 at 20 GHz minimizes signal attenuation, supporting efficient antenna feed networks and low-loss passive components across a broad frequency range.

Excellent PIM Performance:
When paired with reverse-treated RTF copper foil, F4BME245 achieves PIM values of ≤ -159 dBc, making it suitable for sensitive receive paths in base station, satellite, and phased array antennas.

Precise Line Control and Low Conductor Loss:
The reverse-treated RTF copper foil provides finer line definition and lower conductor loss compared to standard ED copper, supporting tight trace/space requirements (4/7 mils in this build) and consistent impedance control.

Dimensional Stability from Glass Reinforcement:
The glass fiber cloth reinforcement provides mechanical strength and dimensional stability, with a CTE of 20 ppm/°C in X and 25 ppm/°C in Y—reasonably matched to copper for plated through-hole reliability. Higher Dk versions offer even greater dimensional stability due to increased glass content.

Ultra-Thin Core Capability:
F4BME245 is available in dielectric thicknesses as thin as 0.1mm (for Dk ≤ 2.65), enabling extremely thin, lightweight constructions. This is essential for compact RF designs where every millimeter and gram counts.

Wide Thickness Range:
The material is available in dielectric thicknesses from 0.1mm up to 12.0mm, enabling a wide variety of circuit designs. Thicknesses of 0.1mm and 0.127mm are available as dielectric-only options.

Radiation and Outgassing Resistance:
The material exhibits radiation resistance and low outgassing, making it suitable for space and aerospace applications.

Cost-Effective and Scalable:
As a commercially available, mass-producible material, F4BME245 offers a high cost-performance ratio, with multiple standard panel sizes (460×610mm, 500×600mm, 850×1200mm, 914×1220mm, 1000×1200mm) and custom sizes available to reduce material waste.

Metal-Backed Options:
The series can be supplied with copper or aluminum bases (F4BME245—CU or F4BME245—AL) for shielding or heat dissipation, with metal base thicknesses from 0.48 mm to 3.98 mm.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative Dk values (2.17 to 3.0), copper foil options (ED or reverse-treated RTF), metal-backed configurations, or other requirements, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.