Rogers TMM10 2 layer PCB built on 5.08mm core substrate with ENIG | Thermoset Microwave Laminate

Product Description

When a design demands the electrical advantages of a ceramic substrate but the processing convenience of a soft laminate, thermoset microwave materials bridge the gap. Rogers TMM10 is a ceramic, hydrocarbon, thermoset polymer composite engineered for high plated-through-hole reliability in stripline and microstrip applications. It combines many of the benefits of both ceramic and traditional PTFE microwave laminates—without requiring the specialized production techniques common to those materials.

TMM10 laminates do not require sodium naphthalate treatment prior to electroless plating, and because they are based on thermoset resins, they do not soften when heated. This allows wire bonding of component leads to circuit traces without concerns of pad lifting or substrate deformation. The material's isotropic coefficients of thermal expansion are very closely matched to copper, enabling high-reliability plated through-holes and low etch shrinkage. Thermal conductivity is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal in power-dense designs.

Available clad with ½ oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates, TMM10 comes in substrate thicknesses from 0.015" to 0.500". The base substrate is resistant to etchants and solvents used in printed circuit production, so all common PWB processes can be used.

Applications

TMM10 is well suited to applications where a high dielectric constant, thermal stability, and reliable plated through-holes are required. Typical applications include:

1. RF and Microwave Circuitry – Filters, couplers, and matching networks
2. Power Amplifiers and Combiners – Efficient heat removal for high-power stages
3. Satellite Communication Systems – Reliable performance in space environments
4. GPS Antennas and Patch Antennas – Compact elements through high Dk
5. Dielectric Polarizers and Lenses – Stable Dk for precise wave manipulation
6. Chip Testers – Dimensionally stable substrates for precision testing

TMM10 and TMM10i laminates can replace alumina substrates in many designs, offering comparable electrical performance with easier processing.

Custom PCB Manufacturing on TMM10

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers TMM10 and other advanced materials. The following specification details a representative double-sided rigid PCB implementation:

PCB Construction Details:

With a Dk of 9.20 ± 0.230 at 10 GHz, TMM10 enables significant size reduction in RF and microwave circuits. This makes it an excellent choice for patch antennas, filters, and other components where footprint is at a premium—and a viable replacement for alumina substrates.

A dissipation factor of 0.0022 at 10 GHz ensures efficient signal transmission, supporting high-performance filters, couplers, and power amplifiers.

The thermal coefficient of Dk is typically less than 30 ppm/°C (measured at -38 ppm/°K), ensuring stable electrical performance across temperature. The isotropic CTE (21/21/20 ppm/°K in X/Y/Z) is closely matched to copper, reducing stress on plated through-holes and improving reliability through thermal cycling.

At 0.76 W/m·K, TMM10 offers approximately twice the thermal conductivity of traditional PTFE/ceramic laminates, facilitating heat removal in power amplifiers and combiners.

Because TMM10 is based on thermoset resins, it does not soften when heated. This allows reliable wire bonding of component leads to circuit traces without concerns of pad lifting or substrate deformation. The material also resists creep and cold flow, maintaining mechanical integrity over time.

TMM10 does not require sodium naphthalate treatment prior to electroless plating, simplifying the plating process. It is resistant to process chemicals, reducing damage during fabrication and assembly. All common PWB processes can be used.

The material's low etch shrinkage and stable dimensions support tight registration tolerances and repeatable manufacturing yields, particularly important in thick substrates like the 5.08mm core in this build.

TMM10 is compatible with lead-free assembly processes, meeting current environmental and reliability requirements.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative thicknesses (0.015" to 0.500"), copper claddings (½ oz to 2 oz), heavy metal or unclad options, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.