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Rogers AD250C laminate and Custom High-Frequency double side PCB built on 0.508 mm (20mil) substrate with Pure gold Surface /No Blind vias /buried vias

Brand Name: Rogers Model Number: AD250C

Product Description

In today's rapidly evolving wireless communication landscape, the demand for high-performance antenna systems continues to grow. Rogers Corporation's AD Series™ antenna materials address these challenges head-on, with the AD250C™ laminate representing a particularly compelling solution for cost-sensitive applications requiring excellent RF performance.

 

 

AD250C is a glass-reinforced, PTFE-based laminate engineered specifically for wireless antenna markets. It combines a controlled dielectric constant with low-loss characteristics and outstanding passive intermodulation (PIM) performance. The woven glass reinforcement ensures good circuit processability, enabling high-yield circuit board fabrication. Available with standard electrodeposited (ED) or reverse-treated ED copper foil options, AD250C laminates help reduce circuit losses and optimize antenna PIM performance.

 

Key Properties at a Glance:

Electrical Properties AD250C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.52 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.50 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -117 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.8 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.1 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 979 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 47 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.33 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.6
(14.8)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 6.0/5.6 (41.4/38.6) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 885/778 (6,102/5,364) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.02/0.06 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.04 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

 

 

Applications

AD250C laminates are widely deployed across multiple wireless infrastructure segments, including:

 

Cellular Infrastructure Base Station Antennas – Feed networks and radiating elements

 

Automotive Telematics Antenna Systems – Connected car applications requiring stable performance across temperature extremes

 

Commercial Satellite Radio Antennas – Low-loss solutions for satellite communications

 

Digital Audio Broadcasting (DAB) – Terrestrial broadcast reception

 

Patch Antennas (GNSS, GPS, SDAR) – Precision positioning and navigation systems

 

Rogers AD250C laminate and Custom High-Frequency double side PCB built on 0.508 mm (20mil) substrate with Pure gold Surface /No Blind vias /buried vias

 

Custom PCB Manufacturing on AD250C

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers AD250C and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

 

PCB Construction Details:

Parameter Specification
Base Material Rogers AD250C
Layer Count 2-layer rigid
Board Dimensions 55.36mm × 76.2mm per panel, ±0.15mm
Finished Thickness 0.6mm
Copper Weight 1 oz (35μm) outer layers
Minimum Trace/Space 4 / 6 mils
Minimum Hole Size 0.4mm
Via Structure No blind or buried vias
Via Plating Thickness 20 μm
Surface Finish Pure gold (electroless nickel immersion gold)
Solder Mask Green, top and bottom
Silkscreen Yellow, top side only
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2

 

 

PCB Statistics:

Metric Count
Components 36
Total Pads 51
Through-Hole Pads 24
Top SMT Pads 27
Bottom SMT Pads 0
Vias 49
Nets 2

 

 

Material Advantages

 

Controlled Dielectric Performance:
AD250C delivers a tightly controlled dielectric constant of 2.50 ± 0.04 at 10 GHz, ensuring consistent impedance control and repeatable circuit performance across production batches. This precision is essential for maintaining antenna matching and minimizing return loss.

 

Low Loss Characteristics:
With a dissipation factor of just 0.0013 at 10 GHz, AD250C enables low insertion loss in transmission lines and feed networks. This translates to higher antenna efficiency and improved system gain.

 

Excellent PIM Performance:
The material achieves very low passive intermodulation values of -159 dBc to -163 dBc (measured on 30 mil and 60 mil laminates with reverse-treated ED copper), dramatically reducing the risk of PIM-related failures in sensitive receive paths.

 

Thermal and Mechanical Stability:

Coefficient of Thermal Expansion (CTE): X-axis (47 ppm/°C), Y-axis (29 ppm/°C), and Z-axis (196 ppm/°C) over the range of -55°C to 288°C

 

Decomposition temperature (Td) exceeds 500°C, providing a wide processing window

 

High Tg > 280°C supports lead-free soldering processes

 

Dimensional Stability:
The woven glass reinforcement and optimized resin system provide excellent dimensional stability (0.02/0.06 mils/inch after etch and bake), minimizing registration errors during multilayer lamination and improving manufacturing yields.

 

Moisture Resistance:
With moisture absorption of only 0.04%, AD250C maintains stable electrical properties even in humid environments, an essential attribute for outdoor antenna applications subject to weather exposure.

 

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial and industrial applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

 

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

 

For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.

 

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