Rogers 3210 High Frequency Circuit Board RO3210 25mil 50mil rf PCB DK 10.8 Radar Antenna PCB
Contact Person : Sally Mao
Phone Number : 86-755-27374847
WhatsApp : +8618277967574
Product Description
In today's rapidly evolving wireless communication landscape, the demand for high-performance antenna systems continues to grow. Rogers Corporation's AD Series™ antenna materials address these challenges head-on, with the AD250C™ laminate representing a particularly compelling solution for cost-sensitive applications requiring excellent RF performance.
AD250C is a glass-reinforced, PTFE-based laminate engineered specifically for wireless antenna markets. It combines a controlled dielectric constant with low-loss characteristics and outstanding passive intermodulation (PIM) performance. The woven glass reinforcement ensures good circuit processability, enabling high-yield circuit board fabrication. Available with standard electrodeposited (ED) or reverse-treated ED copper foil options, AD250C laminates help reduce circuit losses and optimize antenna PIM performance.
Key Properties at a Glance:
| Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
| PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
| Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
| Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | - | UL-94 |
| Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Applications
AD250C laminates are widely deployed across multiple wireless infrastructure segments, including:
Cellular Infrastructure Base Station Antennas – Feed networks and radiating elements
Automotive Telematics Antenna Systems – Connected car applications requiring stable performance across temperature extremes
Commercial Satellite Radio Antennas – Low-loss solutions for satellite communications
Digital Audio Broadcasting (DAB) – Terrestrial broadcast reception
Patch Antennas (GNSS, GPS, SDAR) – Precision positioning and navigation systems
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Custom PCB Manufacturing on AD250C
As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers AD250C and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:
PCB Construction Details:
| Parameter | Specification |
| Base Material | Rogers AD250C |
| Layer Count | 2-layer rigid |
| Board Dimensions | 55.36mm × 76.2mm per panel, ±0.15mm |
| Finished Thickness | 0.6mm |
| Copper Weight | 1 oz (35μm) outer layers |
| Minimum Trace/Space | 4 / 6 mils |
| Minimum Hole Size | 0.4mm |
| Via Structure | No blind or buried vias |
| Via Plating Thickness | 20 μm |
| Surface Finish | Pure gold (electroless nickel immersion gold) |
| Solder Mask | Green, top and bottom |
| Silkscreen | Yellow, top side only |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
PCB Statistics:
| Metric | Count |
| Components | 36 |
| Total Pads | 51 |
| Through-Hole Pads | 24 |
| Top SMT Pads | 27 |
| Bottom SMT Pads | 0 |
| Vias | 49 |
| Nets | 2 |
Material Advantages
Controlled Dielectric Performance:
AD250C delivers a tightly controlled dielectric constant of 2.50 ± 0.04 at 10 GHz, ensuring consistent impedance control and repeatable circuit performance across production batches. This precision is essential for maintaining antenna matching and minimizing return loss.
Low Loss Characteristics:
With a dissipation factor of just 0.0013 at 10 GHz, AD250C enables low insertion loss in transmission lines and feed networks. This translates to higher antenna efficiency and improved system gain.
Excellent PIM Performance:
The material achieves very low passive intermodulation values of -159 dBc to -163 dBc (measured on 30 mil and 60 mil laminates with reverse-treated ED copper), dramatically reducing the risk of PIM-related failures in sensitive receive paths.
Thermal and Mechanical Stability:
Coefficient of Thermal Expansion (CTE): X-axis (47 ppm/°C), Y-axis (29 ppm/°C), and Z-axis (196 ppm/°C) over the range of -55°C to 288°C
Decomposition temperature (Td) exceeds 500°C, providing a wide processing window
High Tg > 280°C supports lead-free soldering processes
Dimensional Stability:
The woven glass reinforcement and optimized resin system provide excellent dimensional stability (0.02/0.06 mils/inch after etch and bake), minimizing registration errors during multilayer lamination and improving manufacturing yields.
Moisture Resistance:
With moisture absorption of only 0.04%, AD250C maintains stable electrical properties even in humid environments, an essential attribute for outdoor antenna applications subject to weather exposure.
Quality and Availability
All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial and industrial applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.
Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.
For inquiries about custom stack-ups, panel sizes, alternative copper foils, or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.
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