Rogers RT/duroid 6202 DK 2.94 to 3.06 High-Frequency Laminate and fabricate PCB Solutions built on 20mil substrate with ENIG

Product Description

In the design of complex microwave structures—from phased array antennas to airborne radar systems—material selection plays a decisive role in achieving reliable, repeatable performance. Rogers RT/duroid 6202 is a low-loss, low-dielectric-constant laminate with limited woven glass reinforcement, engineered to deliver the electrical and mechanical stability essential for demanding high-frequency applications.

RT/duroid 6202 is available with ½ oz. to 2 oz./ft² electrodeposited or rolled copper foil on dielectric thicknesses ranging from 0.005" to 0.060" (0.127 mm to 1.524 mm). Its excellent dimensional stability (0.05 to 0.07 mils/inch) often eliminates the need for double etching to achieve tight positional tolerances, simplifying fabrication and improving yield.

Key Properties at a Glance:

Note: Dk varies by thickness—0.005" laminates are 3.06 ± 0.04; 0.010" and 0.015" laminates are 3.02 ± 0.04; ≥0.020" laminates are 2.94 ± 0.04.

Applications

Phased Array Antennas – Precise element-to-element phase control

Ground-Based and Airborne Radar Systems – Reliable performance in harsh environments

GPS Antennas – Stable Dk for accurate positioning

Power Backplanes – Low loss at high frequencies

Commercial Airline Collision Avoidance – Mission-critical reliability

Beam Forming Networks – Consistent electrical performance across arrays

High-Reliability Complex Multilayer Circuits – Dimensional stability for demanding stack-ups

Custom PCB Manufacturing on RT/duroid 6202

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RT/duroid 6202 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

PCB Statistics:

Low Loss for High-Frequency Performance:

RT/duroid 6202 offers a dissipation factor of just 0.0015 at 10 GHz, minimizing signal attenuation in transmission lines and ensuring excellent high-frequency performance across microwave and millimeter-wave bands.

Excellent Dimensional Stability:
With dimensional stability of 0.05 to 0.07 mils/inch—achieved through limited woven glass reinforcement—RT/duroid 6202 often eliminates double etching, reduces registration errors, and improves manufacturing yields for tight-tolerance designs.

Matched In-Plane Expansion:
The X- and Y-axis CTE of 15 ppm/°C is closely matched to copper, reducing stress on plated through-holes and improving reliability through thermal cycling. The low Z-axis CTE of 30 ppm/°C further enhances dimensional stability in multilayer constructions.

Low Thermal Coefficient of Dk:
At just 5 ppm/°C over -50 to +150°C, the dielectric constant remains highly stable across temperature, ensuring consistent electrical performance in environments subject to wide temperature swings.

Thermal and Moisture Resistance:

1. Decomposition temperature (Td) of 500°C provides a wide processing window
2. Thermal conductivity of 0.68 W/m·K aids heat dissipation
3. Moisture absorption of only 0.04% maintains stable electrical properties in humid conditions
4. UL 94 V-0 flammability rating ensures safety compliance

Very Low Etch Shrinkage:
The material exhibits very low etch shrinkage, contributing to precise feature definition and repeatable circuit performance.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative copper foils (electrodeposited or rolled), or other configurations, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.