Rogers RO4360G2 laminate manufacture 2-layer 12mil thick PCB(ENEPIG) be paired with RO4400™ prepreg and lower-Dk RO4000® laminates in multilayer designs

Product Description

As wireless infrastructure evolves toward higher integration and smaller form factors, designers increasingly need materials that combine high dielectric constant with low loss—and do so without abandoning the processing convenience of FR-4. The RO4360G2 laminate from Rogers Corporation addresses this need directly, offering a 6.15 Dk thermoset material that processes like FR-4 while delivering the electrical performance expected of a high-frequency substrate.

RO4360G2 is a glass-reinforced, hydrocarbon ceramic-filled thermoset laminate engineered to provide an ideal balance of performance and processing ease. It is lead-free process capable and offers better rigidity for improved processability in multilayer board constructions, while reducing both material and fabrication costs. Because its processing is similar to FR-4 and it is automated assembly compatible, RO4360G2 enables a lower total PCB cost solution than competing PTFE products. The material can also be paired with RO4400™ prepreg and lower-Dk RO4000® laminates in multilayer designs.

Key Properties at a Glance:

Applications

Base Station Power Amplifiers – Compact, thermally robust RF power stages

Small Cell Transceivers – Dense integration for urban wireless deployments

Patch Antennas – Reduced element size through higher dielectric constant

Ground-Based Radar – Reliable performance in demanding environments

General RF Applications – Filters, couplers, and impedance matching networks

Custom PCB Manufacturing on RO4360G2

As a specialized manufacturer of high-frequency printed circuit boards, we offer comprehensive fabrication services using Rogers RO4360G2 and other advanced materials. The following specification details a representative 2-layer rigid PCB implementation:

PCB Construction Details:

PCB Statistics:

High Dielectric Constant for Compact Designs:

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 allows designers to shrink circuit dimensions in applications where size and cost are critical. This makes it the best value choice for engineers working on power amplifiers, patch antennas, and other general RF designs.

FR-4 Like Processing:
RO4360G2 processes similar to FR-4, enabling the use of standard fabrication equipment and techniques. This reduces tooling complexity and accelerates production ramp-up compared to PTFE-based alternatives.

Low Loss with High Thermal Conductivity:
The material combines a dissipation factor of 0.0038 at 10 GHz with a thermal conductivity of 0.75 W/m·K, supporting efficient heat dissipation in power-dense RF circuits.

Excellent Dimensional and Thermal Stability:
A low Z-axis CTE of 28 ppm/°C and copper-matched X/Y CTE values (13/14 ppm/°C) provide design flexibility and plated through-hole reliability. The high Tg (>280°C) and Td (>407°C) ensure robust performance through lead-free assembly and thermal cycling.

Lead-Free Process Compatible:
RO4360G2 is fully lead-free process capable and UL 94 V-0 rated, meeting current environmental and safety requirements.

Efficient Supply Chain:
Regional finished goods inventory, short lead times, and quick inventory turns make RO4360G2 a cost-effective material option for both prototyping and volume production.

Multilayer Design Flexibility:
The laminate can be paired with RO4400 prepreg and lower-Dk RO4000 laminates, enabling hybrid stack-ups that balance performance and cost across layers.

Quality and Availability

All boards are manufactured in compliance with IPC-Class-2 quality standards, ensuring robust reliability for commercial, industrial, and defense-related applications. 100% electrical testing is performed prior to shipment to guarantee functional integrity.

Our production capability extends to worldwide availability, with flexible shipping and logistics support for both prototype and volume requirements. We offer rapid turnaround and competitive pricing while maintaining strict process control.

For inquiries about custom stack-ups, panel sizes, alternative surface finishes, or hybrid multilayer configurations using RO4400 prepreg and RO4000 laminates, please contact our sales engineering team—we are ready to support your high-frequency circuit board requirements.