RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||CHINA|
|Brand Name:||Bicheng Enterprise Limited|
|Minimum Order Quantity:||1 PIECE|
|Price:||USD2 .99-7.99 per piece|
|Delivery Time:||8-9 WORKING DAY|
|Supply Ability:||50000 PIECE PER MONTH|
|Board Material:||Polyimide 25μm + 0.3mm FR4 Stiffener||Board Thickness:||0.20 Mm|
|Surface/Inner Layer Cu Thickness:||35 µm||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Yellow||Color Of Silkscreen:||White|
|Function:||100% Pass Electrical Test||Number Of Layers:||2|
Today, we're excited to present Rogers' groundbreaking high dielectric constant PCB, the RO4360G2 high-frequency PCB.
The RO4360G2 PCB is a glass-reinforced, hydrocarbon ceramic-filled thermoset printed circuit board that offers an exceptional balance of performance and manufacturability, comparable to FR-4 PCBs. It is capable of lead-free processes and provides enhanced rigidity in multi-layer board constructions, all while effectively reducing material and fabrication costs.
RO4360G2 Typical Properties
RO4360G2 is an extraordinary material that boasts a wide range of remarkable properties. Let's delve into some of its key features.
First and foremost, let's explore the dielectric constant of RO4360G2. This material maintains a reliable signal transmission with a process value of 6.15±0.15 at 10 GHz and 23°C. Furthermore, it maintains a dielectric constant of 6.15 at 2.5 GHz and 23°C.
Impressively, the dissipation factor, also known as tan delta, is exceptionally low at 0.0038 at 10 GHz and 23°C. This indicates minimal signal loss and ensures outstanding performance.
RO4360G2 exhibits an efficient thermal conductivity of 0.75 W/mK at 50°C, enabling effective heat dissipation within electronic systems.
In terms of electrical properties, RO4360G2 demonstrates high volume resistivity, measuring 4.0 x 10^13 Ω.cm at elevated temperatures. It also exhibits a surface resistivity of 9.0 x 10^12 Ω at elevated temperatures, enhancing its electrical insulation capabilities.
The electrical strength of RO4360G2 is an impressive 784 V/mil, ensuring its durability and reliability in demanding applications.
Moving on to mechanical properties, RO4360G2 showcases a tensile strength of 131 MPa (19 kpsi) in the X direction and 97 MPa (14 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C, as per ASTM D638.
The flexural strength of RO4360G2 measures 213 MPa (31 kpsi) in the X direction and 145 MPa (21 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C, according to IPC-TM-650, 2.4.4.
When it comes to thermal properties, RO4360G2 exhibits a coefficient of thermal expansion of 13 ppm/°C along the X axis, 14 ppm/°C along the Y axis, and 28 ppm/°C along the Z axis, from -50°C to 288°C after a replicated heat cycle, as per IPC-TM-650, 2.1.41.
The glass transition temperature (Tg) of RO4360G2 is greater than 280°C, as determined by TMA according to IPC-TM-650 220.127.116.11.
The material also has a thermal decomposition temperature (Td) of 407°C, as measured by ASTM D3850 using TGA.
RO4360G2 showcases a T288 value of greater than 30 minutes in the Z direction, at a minimum temperature of 125°C during prebake, as per IPC-TM-650 18.104.22.168.
With a moisture absorption of 0.08% at 50°C and 48 hours, RO4360G2 demonstrates excellent resistance to moisture penetration, as tested using IPC-TM-650 22.214.171.124 and ASTM D570.
The thermal coefficient of the dielectric constant (er) for RO4360G2 is -131 ppm/°C at 10 GHz in the Z direction, from -50°C to 150°C, as specified by IPC-TM-650 126.96.36.199.
RO4360G2 has a density of 2.16 gm/cm³ at room temperature, providing a lightweight yet robust material for electronic applications.
The copper peel strength of RO4360G2 measures 5.2 pli (0.91 N/mm) under Condition B, as tested according to IPC-TM-650 2.4.8.
Lastly, RO4360G2 has achieved the V-0 rating for flammability according to UL 94 File QMTS2. E102765, ensuring its resistance to ignition and flame propagation.
|Dielectric Constant,εProcess||6.15±0.15||Z||10 GHz/23℃||IPC-TM-650 188.8.131.52|
|Dissipation Factor,tanδ||0.0038||Z||10 GHz/23℃||IPC-TM-650 184.108.40.206|
|Thermal Conductivity||0.75||W/mK||50℃||ASTM D-5470|
|Volume Resistivity||4.0 X 1013||Ω.cm||Elevated T||IPC-TM-650 220.127.116.11|
|Surface Resistivity||9.0 X 1012||Ω||Elevated T||IPC-TM-650 18.104.22.168|
|Electrical Strength||784||Z||V/mil||IPC-TM-650 22.214.171.124|
|Tensile Strength||131 (19) 97(14)||X Y||MPa (kpsi)||40 hrs 50%RH/23||ASTM D638|
|Flexural Strength||213(31) 145(21)||X Y||Mpa (kpsi)||40 hrs 50%RH/23||IPC-TM-650, 2.4.4|
|Coefficient of Thermal Expansion||13 14 28||X Y Z||ppm/℃||-50 ℃to 288℃ After Replicated Heat Cycle||IPC-TM-650, 2.1.41|
|Tg||>280||℃ TMA||IPC-TM-650 126.96.36.199|
|Td||407||℃||ASTM D3850 using TGA|
|T288||>30||Z||min||30 min / 125℃ Prebake||IPC-TM-650 188.8.131.52|
|Moisure Absorption||0.08||%||50℃/48hr||IPC-TM-650 184.108.40.206 ASTM D570|
|Thermal Coefficient of er||-131 @10 GHz||Z||ppm/℃||-50℃ to 150 ℃||IPC-TM-650, 220.127.116.11|
|Copper Peel Stength||5.2 (0.91)||pli (N/mm)||Condtion B||IPC-TM-650 2.4.8|
|Flammability||V-0||UL 94 File QMTS2. E102765|
RO4360G2 PCB Capabilities
For RO4360G2 printed circuit boards, we offer single-layer, double-layer, multilayer, and hybrid constructions. These boards can be fabricated in a wide range of thicknesses, including standard values like 12 mils, 20 mils, 32 mils, 60 mils, as well as non-standard thicknesses such as 8 mils, 16 mils, 24 mils.
The finished copper weight on the PCBs can be specified as 1 oz, 2 oz, or 3 oz. Our maximum panel size for high frequency RO4360G2 boards is 400mm by 500mm. This allows production of either a single large board or many smaller, different designs on one panel.
Various solder mask colors are available, including green, black, blue, yellow, and more. For pad plating, we offer immersion gold, HASL, immersion silver, immersion tin, and bare copper finishes. Please contact us to discuss your specific RO4360G2 PCB requirements.
Spotlight on RO4360G2
Let's examine an example 60-mil thick RO4360G2 PCB with immersion gold plating on the pads. This panel contains 20 boards designed for small cell transceivers applications. With its excellent high frequency performance, RO4360G2 is an ideal material choice for RF engineers working on components like power amplifiers, patch antennas, ground-based radar systems, and base station amplifiers.
RO4360G2 boards offer reliable plated through-hole construction compatible with automated assembly and lead-free processes. The material can be combined with RO4450F prepreg and lower dielectric constant laminates like RO4350B and RO4003C in multilayer stackups.
That concludes today's overview of Rogers RO4360G2 high frequency PCB capabilities. Thank you for joining us - see you next time!
Contact Person: Miss. Sally Mao