F4BTM300 Fabricate PCB 2-Layer 35um copper bulit on 10mil laminate with ENIG Finish using in Microwave, RF

Custom 2-Layer 10mil F4BTM300 PCB with ENIG Finish

Introducing a 2-layer 10mil PCB using F4BTM300 laminate, designed for high-frequency RF, microwave, and aerospace applications. Leveraging the low-loss ceramic/PTFE composite properties of F4BTM300, this PCB ensures superior signal integrity, low dissipation, and thermal stability. The ENIG (Electroless Nickel Immersion Gold) finish provides excellent solderability and long-term reliability, making this PCB suitable for radar systems, phased array antennas, and satellite communications. Manufactured to IPC-Class-2 standards, this PCB is optimized for demanding environments.

PCB Construction Details

PCB Stackup

The F4BTM300 core provides tight dielectric constant control, low dissipation factor, and excellent thermal conductivity, making it ideal for microwave and RF circuits.

PCB Statistics

This PCB is designed for compact, high-performance circuits with the following layout characteristics:

The Gerber RS-274-X format ensures precise artwork for seamless fabrication.

About F4BTM300 Laminate

F4BTM300 laminates are nano-ceramic/PTFE composites reinforced with glass fiber cloth, offering high dielectric constant stability, low loss tangent, and excellent thermal resistance. These laminates are specifically designed for aerospace, radar, and microwave applications and provide dimensional stability and enhanced signal performance.

Key Features of F4BTM300:

• Dielectric Constant (Dk): 3 ± 0.06 at 10GHz, providing precise impedance control.
• Dissipation Factor (Df): 0.0018 at 10GHz and 0.0023 at 20GHz, ensuring minimal signal loss.
• CTE (Coefficient of Thermal Expansion): X-axis: 15 ppm/°C, Y-axis: 16 ppm/°C, Z-axis: 72 ppm/°C
• Thermal Coefficient of Dk: -75 ppm/°C, ensuring phase stability over temperature ranges (-55°C to 150°C).
• Moisture Absorption: 0.05%, ideal for humid environments.
• Thermal Stability: Withstands up to 288°C, ensuring durability under extreme thermal conditions.
• Flammability: UL-94 V0, meeting industry safety standards.

F4BTM laminates are paired with reverse-treated RTF copper foil, reducing conductor loss, improving PIM (Passive Intermodulation), and enabling precise line control.

Benefits of F4BTM300-Based PCBs

The low dissipation factor (Df) and tight Dk tolerance ensure minimal signal distortion and consistent impedance control at high frequencies.

The low thermal coefficient of Dk and excellent thermal conductivity (0.64 W/mK) provide consistent performance across wide temperature ranges and enable efficient heat dissipation.

With a moisture absorption rate of 0.05%, the PCB remains stable in humid and harsh environments.

The material’s dimensional stability and compatibility with standard PCB processes ensure easy fabrication and high reliability.

The ENIG surface finish offers excellent solderability, corrosion resistance, and wire-bonding compatibility, making it ideal for high-reliability applications.

F4BTM300 laminates provide low insertion loss and minimal conductor loss, making them suitable for high-power and high-frequency applications.

Application Scenarios

This 10mil F4BTM300 PCB is designed for a range of advanced RF and microwave applications, including:

Microwave and RF Applications

Radar Systems

Feed Networks

Phase-Sensitive Antennas

Satellite Communications

Conclusion

The 2-layer 10mil F4BTM300 PCB with ENIG finish is a cutting-edge solution for aerospace, radar, and microwave applications. Its low dissipation factor, thermal stability, and dimensional precision make it a top choice for industries requiring high-frequency performance and reliable signal integrity. Backed by IPC-Class-2 standards and 100% electrical testing, this PCB is designed to exceed performance expectations.

For more information or to discuss custom designs, contact us today. Let us help you achieve success in your next high-frequency project!