4-Layer PCB with 0.254mm RT5880 + TG170 FR-4 PP Hybrid PCB outer layer 1OZ inner layer 0.5OZ with immersion silver finish

4-Layer PCB with RT5880 + TG170 FR-4 Hybrid Stackup

Designed with precision and high-performance materials, this 4-layer PCB combines RT5880 high-frequency laminate and TG170 FR-4 prepreg for exceptional electrical performance, mechanical stability, and cost-effectiveness. With a compact design and robust construction, this PCB is ideal for applications in RF, microwave, telecommunications, and aerospace industries where high-frequency performance and reliability are essential.

PCB Specifications

This PCB is engineered to meet stringent technical requirements, ensuring optimal performance. Below are the detailed specifications:

PCB Stackup

This PCB features a specialized hybrid stackup that combines RT5880 and TG170 FR-4 PP, providing the perfect balance of high-frequency performance and structural integrity:

Material Properties

RT5880 (High-Frequency Laminate):

• Dielectric Constant (Dk): 2.2 ± 0.02 at 10GHz, ensuring precise signal integrity.
• Dissipation Factor (Df): 0.0009 at 10GHz, providing ultra-low signal loss.
• Moisture Absorption: <0.02%, ensuring stability in humid environments.
• Thermal Conductivity: High, enabling efficient heat dissipation.
• Applications: Ideal for RF and microwave designs requiring low loss and high precision.

TG170 FR-4 Prepreg:

• Glass Transition Temperature (Tg): 170°C, ensuring excellent thermal stability.
• Mechanical Strength: High, providing robust support for the PCB structure.
• Compatibility: Works seamlessly with RT5880 to create a hybrid stackup with improved mechanical and electrical properties.
• Applications: Suitable for cost-sensitive designs requiring structural stability.

Key Features and Benefits

The RT5880 laminate ensures low dielectric loss and excellent signal integrity, enabling reliable operation at high frequencies.

The inclusion of TG170 FR-4 PP provides exceptional structural support and thermal reliability, allowing the PCB to handle high operating temperatures.

With a minimum line width/spacing of 5mil/5mil and 0.2mm via holes, this PCB is ideal for compact, high-density designs.

The immersion silver finish provides excellent solderability, corrosion resistance, and long-term reliability.

Combining RT5880 and TG170 FR-4 ensures the perfect balance of electrical performance and mechanical strength, making this PCB cost-effective and high-performing.

The low moisture absorption of RT5880 ensures stable performance in challenging environmental conditions, such as high humidity or extreme temperatures.

Application Scenarios

This PCB, with its advanced hybrid stackup and high-frequency capabilities, is suitable for a wide range of applications, including:

1. RF and Microwave Applications
2. Telecommunications
3. Aerospace and Defense
4. Automotive Radar Systems
5. Medical Electronics

Conclusion

The 4-layer PCB with RT5880 and TG170 FR-4 hybrid stackup offers an unbeatable combination of high-frequency performance, thermal stability, and cost-effective manufacturability. Its superior material properties and precise construction make it the perfect choice for high-frequency RF and microwave applications, as well as demanding environments.

For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs tailored to your specific needs!