Fabricate 2-Layer TMM6 PCB built on 15mil laminate and double sided copper with ENEPIG Finish using in Patch Antennas

Custom 2-Layer TMM6 PCB with ENEPIG Finish

Introducing a high-reliability 2-layer PCB, built on Rogers TMM6 laminate, designed for advanced RF and microwave applications. With its high dielectric constant (Dk), excellent thermal stability, and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) finish, this PCB is ideal for satellite communications, power amplifiers, and patch antennas. Manufactured to IPC-Class-2 standards, this PCB meets the needs of high-performance, precision circuit designs.

PCB Construction Details

PCB Stackup

The stackup of this PCB is specifically designed for high-frequency stability and efficient signal transmission. Its structure is as follows:

The TMM6 core ensures consistent dielectric properties, while the ENEPIG finish offers excellent solderability and wire-bonding compatibility, making the PCB suitable for advanced RF designs.

PCB Statistics

The PCB is configured for compact, high-frequency designs, with the following characteristics:

The Gerber RS-274-X format is used for artwork to ensure seamless fabrication.

About Rogers TMM6 Laminate

Rogers TMM6 is a thermoset microwave material, combining the benefits of ceramic composites and traditional PTFE laminates. It provides high plated thru-hole reliability and is suitable for stripline and microstrip circuit applications. The material is known for its excellent dielectric properties, mechanical stability, and ease of processing.

Key Features of TMM6:

• Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz and 23°C, ensuring stable impedance for RF and microwave circuits.
• Dissipation Factor (Df): 0.0023 at 10GHz, reducing signal loss.
• Thermal Coefficient of Dk: -11 ppm/°K, providing consistent performance across temperature changes.
• Thermal Conductivity: 0.72 W/mK, supporting heat dissipation.
• CTE (Coefficient of Thermal Expansion): X-axis: 18 ppm/K, Y-axis: 18 ppm/K, Z-axis: 26 ppm/K
• Decomposition Temperature (Td): 425°C, ensuring durability under thermal stress.
• Flammability: UL 94V-0, meeting safety standards.

TMM6 laminates are resistant to process chemicals, conform to lead-free manufacturing requirements, and can be fabricated using common PCB processes.

Benefits of TMM6-Based PCBs

The low dissipation factor and stable dielectric constant ensure minimal signal loss and consistent impedance control, even at high frequencies.

With a decomposition temperature of 425°C and a thermal expansion coefficient matched to copper, this PCB ensures dimensional integrity during thermal cycling.

TMM6 materials resist creep and cold flow, making them suitable for robust wire-bonding and high-reliability designs.

Resistant to process chemicals and solvents, the PCB maintains its performance under extreme conditions.

The ENEPIG surface finish provides superior solderability, corrosion resistance, and wire-bonding compatibility, making the PCB versatile for various applications.

Application Scenarios

Power Amplifiers and Combiners

Satellite Communication Systems

Global Positioning Systems (GPS) Antennas

Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

Conclusion

The 2-layer 15mil TMM6 PCB with ENEPIG finish is a high-performance solution for RF, microwave, and satellite communication applications. Its stable dielectric properties, thermal reliability, and high-frequency capabilities make it a top choice for industries requiring precision and durability. Backed by IPC-Class-2 standards and 100% tested for quality assurance, this PCB delivers unparalleled performance.

For more information or to request a custom quote, contact us today. We’re ready to help you achieve success in your next high-frequency project!