| MOQ: | 1PCS |
| Price: | 0.99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish
Introducing our 2-layer PCB built on F4BM217 laminate, a high-performance material designed for microwave, RF, and radar systems. This PCB delivers exceptional electrical performance, dimensional stability, and low dielectric loss, making it ideal for advanced applications like phased array antennas, satellite communications, and power dividers. With its ultra-thin 0.17mm thickness and ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB offers outstanding reliability and precision.
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PCB Construction Details
The construction of this double-sided F4BM217 PCB is tailored for high-frequency and high-performance applications. Below are the detailed specifications:
| Parameter | Specification |
| Base Material | F4BM217 |
| Layer Count | 2-layer (double-sided) |
| Board Dimensions | 120mm x 89mm ± 0.15mm |
| Finished Thickness | 0.17mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.3mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top/Bottom Silkscreen | None |
| Top/Bottom Solder Mask | None |
| Electrical Testing | 100% testing prior to shipment |
| Quality Standard | IPC-Class-2 |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Electro-deposited Copper | 35μm (1oz) |
| Core Material | F4BM217 | 0.1mm |
| Copper Layer 2 | Electro-deposited Copper | 35μm (1oz) |
This combination of F4BM217 core and ED copper foil ensures exceptional electrical performance, low dissipation factor, and dimensional stability.
PCB Statistics
The PCB is optimized for compact designs, with the following characteristics:
| Attribute | Value |
| Components | 5 |
| Total Pads | 21 |
| Thru Hole Pads | 15 |
| Top SMT Pads | 6 |
| Bottom SMT Pads | 0 |
| Vias | 25 |
| Nets | 2 |
About F4BM217 Material
The F4BM217 laminate from Wangling is a ceramic-filled polytetrafluoroethylene (PTFE) composite, paired with electro-deposited (ED) copper foil for superior electrical and mechanical performance. It offers low dielectric loss, enhanced insulation resistance, and outstanding stability under various conditions.
Key Features of F4BM217:
The material’s precise dielectric constant control allows for low loss and dimensional stability, making it a cost-effective alternative to similar foreign materials.
Benefits of the F4BM217 PCB
With a low dielectric constant and dissipation factor, the PCB is optimized for RF and microwave designs, ensuring minimal signal loss and reliable performance.
Its low CTE and high thermal reliability make it suitable for applications involving extreme temperatures, ensuring durability and precision.
The low moisture absorption ensures consistent performance in challenging environmental conditions.
The use of F4BM217 allows for economical volume production without compromising on performance or quality.
The PCB’s material properties and design make it ideal for a wide range of industries, including telecommunications, aerospace, and satellite systems.
Application Scenarios
Microwave, RF, and Radar Systems
Phase Shifters and Power Dividers
Phased Array Antennas
Satellite Communications
Base Station Antennas
Conclusion
The 2-layer F4BM217 PCB with ENIG finish offers superior performance, thermal stability, and cost-effective manufacturing for microwave, RF, and radar applications. Its low loss, dimensional stability, and reliable construction make it the perfect solution for industries requiring high-frequency precision and durability.
For more details or to request a quote, contact us today. We look forward to providing you with high-quality PCBs tailored to your unique requirements!
| MOQ: | 1PCS |
| Price: | 0.99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish
Introducing our 2-layer PCB built on F4BM217 laminate, a high-performance material designed for microwave, RF, and radar systems. This PCB delivers exceptional electrical performance, dimensional stability, and low dielectric loss, making it ideal for advanced applications like phased array antennas, satellite communications, and power dividers. With its ultra-thin 0.17mm thickness and ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB offers outstanding reliability and precision.
![]()
PCB Construction Details
The construction of this double-sided F4BM217 PCB is tailored for high-frequency and high-performance applications. Below are the detailed specifications:
| Parameter | Specification |
| Base Material | F4BM217 |
| Layer Count | 2-layer (double-sided) |
| Board Dimensions | 120mm x 89mm ± 0.15mm |
| Finished Thickness | 0.17mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.3mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top/Bottom Silkscreen | None |
| Top/Bottom Solder Mask | None |
| Electrical Testing | 100% testing prior to shipment |
| Quality Standard | IPC-Class-2 |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Electro-deposited Copper | 35μm (1oz) |
| Core Material | F4BM217 | 0.1mm |
| Copper Layer 2 | Electro-deposited Copper | 35μm (1oz) |
This combination of F4BM217 core and ED copper foil ensures exceptional electrical performance, low dissipation factor, and dimensional stability.
PCB Statistics
The PCB is optimized for compact designs, with the following characteristics:
| Attribute | Value |
| Components | 5 |
| Total Pads | 21 |
| Thru Hole Pads | 15 |
| Top SMT Pads | 6 |
| Bottom SMT Pads | 0 |
| Vias | 25 |
| Nets | 2 |
About F4BM217 Material
The F4BM217 laminate from Wangling is a ceramic-filled polytetrafluoroethylene (PTFE) composite, paired with electro-deposited (ED) copper foil for superior electrical and mechanical performance. It offers low dielectric loss, enhanced insulation resistance, and outstanding stability under various conditions.
Key Features of F4BM217:
The material’s precise dielectric constant control allows for low loss and dimensional stability, making it a cost-effective alternative to similar foreign materials.
Benefits of the F4BM217 PCB
With a low dielectric constant and dissipation factor, the PCB is optimized for RF and microwave designs, ensuring minimal signal loss and reliable performance.
Its low CTE and high thermal reliability make it suitable for applications involving extreme temperatures, ensuring durability and precision.
The low moisture absorption ensures consistent performance in challenging environmental conditions.
The use of F4BM217 allows for economical volume production without compromising on performance or quality.
The PCB’s material properties and design make it ideal for a wide range of industries, including telecommunications, aerospace, and satellite systems.
Application Scenarios
Microwave, RF, and Radar Systems
Phase Shifters and Power Dividers
Phased Array Antennas
Satellite Communications
Base Station Antennas
Conclusion
The 2-layer F4BM217 PCB with ENIG finish offers superior performance, thermal stability, and cost-effective manufacturing for microwave, RF, and radar applications. Its low loss, dimensional stability, and reliable construction make it the perfect solution for industries requiring high-frequency precision and durability.
For more details or to request a quote, contact us today. We look forward to providing you with high-quality PCBs tailored to your unique requirements!