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Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish using in Microwave, RF, and Radar Systems

Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish using in Microwave, RF, and Radar Systems

MOQ: 1PCS
Price: 0.99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
F4B
Certification
ISO9001
Model Number
F4BM217
Minimum Order Quantity:
1PCS
Price:
0.99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish

 

Introducing our 2-layer PCB built on F4BM217 laminate, a high-performance material designed for microwave, RF, and radar systems. This PCB delivers exceptional electrical performance, dimensional stability, and low dielectric loss, making it ideal for advanced applications like phased array antennas, satellite communications, and power dividers. With its ultra-thin 0.17mm thickness and ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB offers outstanding reliability and precision.

 

Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish using in Microwave, RF, and Radar Systems 0

 

PCB Construction Details

The construction of this double-sided F4BM217 PCB is tailored for high-frequency and high-performance applications. Below are the detailed specifications:

Parameter Specification
Base Material F4BM217
Layer Count 2-layer (double-sided)
Board Dimensions 120mm x 89mm ± 0.15mm
Finished Thickness 0.17mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.3mm
Via Plating Thickness 20μm
Surface Finish Immersion Gold (ENIG)
Top/Bottom Silkscreen None
Top/Bottom Solder Mask None
Electrical Testing 100% testing prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Electro-deposited Copper 35μm (1oz)
Core Material F4BM217 0.1mm
Copper Layer 2 Electro-deposited Copper 35μm (1oz)

This combination of F4BM217 core and ED copper foil ensures exceptional electrical performance, low dissipation factor, and dimensional stability.

 

 

PCB Statistics

The PCB is optimized for compact designs, with the following characteristics:

Attribute Value
Components 5
Total Pads 21
Thru Hole Pads 15
Top SMT Pads 6
Bottom SMT Pads 0
Vias 25
Nets 2

 

 

About F4BM217 Material

The F4BM217 laminate from Wangling is a ceramic-filled polytetrafluoroethylene (PTFE) composite, paired with electro-deposited (ED) copper foil for superior electrical and mechanical performance. It offers low dielectric loss, enhanced insulation resistance, and outstanding stability under various conditions.

 

 

Key Features of F4BM217:

  • Dielectric Constant (Dk): 2.17 ± 0.04 at 10GHz, providing consistent impedance control.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -150 ppm/°C (-55°C to 150°C), delivering stable performance across temperature variations.
  • CTE (Coefficient of Thermal Expansion): X-axis: 25 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 240 ppm/°C (-55°C to 288°C)
  • Moisture Absorption: ≤0.08%, ensuring reliability in humid environments.
  • Flammability Rating: UL-94 V0, meeting safety standards.

The material’s precise dielectric constant control allows for low loss and dimensional stability, making it a cost-effective alternative to similar foreign materials.

 

 

Benefits of the F4BM217 PCB

 

With a low dielectric constant and dissipation factor, the PCB is optimized for RF and microwave designs, ensuring minimal signal loss and reliable performance.

 

Its low CTE and high thermal reliability make it suitable for applications involving extreme temperatures, ensuring durability and precision.

 

The low moisture absorption ensures consistent performance in challenging environmental conditions.

 

The use of F4BM217 allows for economical volume production without compromising on performance or quality.

 

The PCB’s material properties and design make it ideal for a wide range of industries, including telecommunications, aerospace, and satellite systems.

 

 

Application Scenarios

Microwave, RF, and Radar Systems

Phase Shifters and Power Dividers

Phased Array Antennas

Satellite Communications

Base Station Antennas

 

 

Conclusion

The 2-layer F4BM217 PCB with ENIG finish offers superior performance, thermal stability, and cost-effective manufacturing for microwave, RF, and radar applications. Its low loss, dimensional stability, and reliable construction make it the perfect solution for industries requiring high-frequency precision and durability.

 

 

For more details or to request a quote, contact us today. We look forward to providing you with high-quality PCBs tailored to your unique requirements!

 

products
PRODUCTS DETAILS
Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish using in Microwave, RF, and Radar Systems
MOQ: 1PCS
Price: 0.99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Brand Name
F4B
Certification
ISO9001
Model Number
F4BM217
Minimum Order Quantity:
1PCS
Price:
0.99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish

 

Introducing our 2-layer PCB built on F4BM217 laminate, a high-performance material designed for microwave, RF, and radar systems. This PCB delivers exceptional electrical performance, dimensional stability, and low dielectric loss, making it ideal for advanced applications like phased array antennas, satellite communications, and power dividers. With its ultra-thin 0.17mm thickness and ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB offers outstanding reliability and precision.

 

Custom 2-Layer F4BM217 PCB built on 3.9mil laminate with ENIG Finish using in Microwave, RF, and Radar Systems 0

 

PCB Construction Details

The construction of this double-sided F4BM217 PCB is tailored for high-frequency and high-performance applications. Below are the detailed specifications:

Parameter Specification
Base Material F4BM217
Layer Count 2-layer (double-sided)
Board Dimensions 120mm x 89mm ± 0.15mm
Finished Thickness 0.17mm
Copper Weight 1oz (1.4 mils) outer layers
Minimum Trace/Space 6/7 mils
Minimum Hole Size 0.3mm
Via Plating Thickness 20μm
Surface Finish Immersion Gold (ENIG)
Top/Bottom Silkscreen None
Top/Bottom Solder Mask None
Electrical Testing 100% testing prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Electro-deposited Copper 35μm (1oz)
Core Material F4BM217 0.1mm
Copper Layer 2 Electro-deposited Copper 35μm (1oz)

This combination of F4BM217 core and ED copper foil ensures exceptional electrical performance, low dissipation factor, and dimensional stability.

 

 

PCB Statistics

The PCB is optimized for compact designs, with the following characteristics:

Attribute Value
Components 5
Total Pads 21
Thru Hole Pads 15
Top SMT Pads 6
Bottom SMT Pads 0
Vias 25
Nets 2

 

 

About F4BM217 Material

The F4BM217 laminate from Wangling is a ceramic-filled polytetrafluoroethylene (PTFE) composite, paired with electro-deposited (ED) copper foil for superior electrical and mechanical performance. It offers low dielectric loss, enhanced insulation resistance, and outstanding stability under various conditions.

 

 

Key Features of F4BM217:

  • Dielectric Constant (Dk): 2.17 ± 0.04 at 10GHz, providing consistent impedance control.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -150 ppm/°C (-55°C to 150°C), delivering stable performance across temperature variations.
  • CTE (Coefficient of Thermal Expansion): X-axis: 25 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 240 ppm/°C (-55°C to 288°C)
  • Moisture Absorption: ≤0.08%, ensuring reliability in humid environments.
  • Flammability Rating: UL-94 V0, meeting safety standards.

The material’s precise dielectric constant control allows for low loss and dimensional stability, making it a cost-effective alternative to similar foreign materials.

 

 

Benefits of the F4BM217 PCB

 

With a low dielectric constant and dissipation factor, the PCB is optimized for RF and microwave designs, ensuring minimal signal loss and reliable performance.

 

Its low CTE and high thermal reliability make it suitable for applications involving extreme temperatures, ensuring durability and precision.

 

The low moisture absorption ensures consistent performance in challenging environmental conditions.

 

The use of F4BM217 allows for economical volume production without compromising on performance or quality.

 

The PCB’s material properties and design make it ideal for a wide range of industries, including telecommunications, aerospace, and satellite systems.

 

 

Application Scenarios

Microwave, RF, and Radar Systems

Phase Shifters and Power Dividers

Phased Array Antennas

Satellite Communications

Base Station Antennas

 

 

Conclusion

The 2-layer F4BM217 PCB with ENIG finish offers superior performance, thermal stability, and cost-effective manufacturing for microwave, RF, and radar applications. Its low loss, dimensional stability, and reliable construction make it the perfect solution for industries requiring high-frequency precision and durability.

 

 

For more details or to request a quote, contact us today. We look forward to providing you with high-quality PCBs tailored to your unique requirements!

 

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