Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement

TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement

  • TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement
TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-253-V2.53
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Board Material: Polyimide (PI) 25 Um
Surface Cu Thickness: 1.0 Board Thickness: 0.15mm +/-10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

TP High Frequency PCB

Microwave composite dielectric copper-clad laminate - TP



TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 refers to the material with copper cladding on one side, and TP-2 refers to the material with copper cladding on both sides.



1. The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz.

  • Long-term operating temperature ranges from -100°C to +150°C. It has excellent low-temperature resistance. When the temperature exceeds 180°C, the material may deform, the copper foil may peel off, and there may be significant changes in electrical performance.
  • The thinnest thickness is 0.5mm, and it is available in various thicknesses and can be customized.
  • It is resistant to radiation and has low outgassing.
  • Ideal material for Beidou, missile-borne, fuze, and miniaturized antennas.
  • The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine and can be processed through drilling, turning, grinding, shearing, etching, and other methods, which ceramic substrates cannot achieve.
  • Convenient for PCB processing, it can be processed using methods suitable for thermoplastic materials, resulting in high yield and reduced processing cost compared to ceramic substrates. Due to the characteristics of the material, it is generally not recommended for multilayer PCB processing. If multilayer PCB processing is required, low-temperature bonding sheets should be selected, and feasibility should be fully considered.


Data Sheet

Product Technical Parameter Product Models & Data Sheet
Product Features Test Conditions Unit TP TP-1 TP-2
Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz.

When the dielectric constant is >11, the test condition is 5GHz.
/ 3.0±0.06 4.4±0.09 6.0±0.12
6.15±0.12 9.2±0.18 9.6±0.19
10.2±0.2 11.0±0.022 16.0±0.4
20.0±0.8 22.0±0.88 25.0±1.0
The dielectric constant can be customized within the range of 3.0 to 25.
Dielectric Constant Tolerance Dielectric Constant 3.011.0 / ±2%
Dielectric Constant 11.116.0 / ±2.5%
Dielectric Constant 16.125.0 / ±4%
Loss Tangent Loss Tangent 3.0~9.5 10GHz / 0.0010
Loss Tangent 9.6~11.0 10GHz / 0.0012
Loss Tangent 11.1~16.0 5GHz / 0.0015
Loss Tangent 16.1~25.0 5GHz / 0.00200.0025
Dielectric Constant Temperature Coefficient Dielectric Constant 3.09.5 -55 º~150ºC PPM/ -50
Dielectric Constant 9.6~16.0 -55 º~150ºC PPM/ -40
Dielectric Constant 16.1~25.0 -55 º~150ºC PPM/ -55
Peel Strength 1 OZ Normal State N/mm >0.6
1 OZ After AC Humidity Test N/mm >0.4
Volume Resistivity Normal State at 500V MΩ.cm >1×109
Surface Resistivity Normal State at 500V >1×107
Coefficient of Thermal Expansion
(XY Z)
Dielectric Constant 3.00~4.40 -55 º~150ºC PPM/ 60,60,70
Dielectric Constant 4.60~6.15 -55 º~150ºC PPM/ 50,50,60
Dielectric Constant 6.16~11.0 -55 º~150ºC PPM/ 40,40,55
Dielectric Constant 11.1~16.0 -55 º~150ºC PPM/ 40,40,50
Dielectric Constant 16.1~25.0 -55 º~150ºC PPM/ 35,35,40
Water Absorption 20±2, 24 hours % ≤0.01
Long-Term Operating Temperature High-Low Temperature Chamber -100º~150ºC
Material Composition Polyphenylene ether, ceramic, paired with ED copper foil.
The density and thermal conductivity data for materials with different dielectric constants are as follows:
Product Features Unit Dielectric Constanct
3.0 4.4 6.0 6.15 9.6 10.2 11.0 16.0 20.0 22.0 25.0
Density g/cm3 1.69 1.89 2.1 2.12 2.26 2.33 2.40 2.76 2.73 2.77 2.94
Thermal Conductivity W/(M.K) 0.40 0.44 0.55 0.55 0.65 0.67 0.70 0.80 0.85 0.90 1.0


Our PCB Capability (TP Series)

PCB Capability (TP Series)
PCB Material: Polyphenylene ether, ceramic
Designation (TP Series) Designation DK DF
TP300 3.0±0.06 0.0010
TP440 4.4±0.09 0.0010
TP600 6.0±0.12 0.0010
TP615 6.15±0.12 0.0010
TP920 9.2±0.18 0.0010
TP960 9.6±0.2 0.0011
TP1020 10.2±0.2 0.0011
TP1100 11.0±0.22 0.0011
TP1600 16.0±0.32 0.0015
TP2000 20.0±0.4 0.0020
TP2200 22.0±0.44 0.0022
TP2500 25.0±0.5 0.0025
Layer count: Single Sided, Double Sided PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness (Dielectric thickness or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤150mm X 220mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..


A TP PCB and Applications

On the screen, you can see a 1.5mm TP high-frequency PCB with OSP (Organic Solderability Preservative) coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas.


Final Attention

The material is not suitable for 260°C thermal shock testing and cannot be wave soldered. Hand soldering with a constant temperature soldering iron is recommended. Reflow soldering is generally not recommended. If reflow soldering is carried out, the highest set temperature should not exceed 200°C, and feasibility and stability should be fully considered.

Why choose us?
1) Focus on your core competencies: We’ve deeply known it is full of fierce competition for our customers in the market. You can focus on such important competencies as research and development, sales and marketing based on our professional performance and skilled services that exceeding your expectation.
2) Cutting-edge technology: it is rational for a small and medium-sized customer to hanker after the latest equipment and manufacturing expertise for its PCBs. By the partnerships
with Bicheng PCB, you gain access to reach your expectation with our 3 factory bases with over 26,000 square meters.
4) Save the cost of production: Production cost is one of the key points of our customers’ product competitiveness. Bicheng PCB have been striving to reduce its manufacturing cost from equipment introduce, worker training and technology improvement to increase their profitability. Customers are satisfied with our cost savings but without quality loss.
5) Avoid hassle: It’s an upset matter when quality problem hassling you. Bicheng engineering design prevents problem from occurring in pre-production. You will not get headache with Bicheng prototypes, small orders and volume production. Our rate of customer complaint is less than 1% and will be solved satisfactory.
6) Save time: Market requires the products updating quickly. Bicheng PCB always works fast and flexible to save the time of production from prototype to standard production,
quick turn-around or scheduled deliveries.
7) An excellent team: Bicheng is trustworthy partner with passion, discipline, responsibility and honesty. We have a team of experienced sales persons and skilled customer services. Do not change your supplier. If change is must, Bicheng is the right one for you.
TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement 0
TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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