Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of 8-layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of Mobile Broadband. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and Immersion gold on pads. 80 strips of gold fingers are on edge for inserting usage.The base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benefits

1. High Tg material shows excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application;

2. Gold fingers reduce contact resistance;

3. 16000㎡ workshop;

4. Meeting your PCB needs from prototype to mass production.

5. Strict WIP inspection and monitoring as well as working instruction;

6. IPC Class 2 / IPC Class 3;

7. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

8. Diversified shipping method: FedEx, DHL, TNT, EMS;

9. No MOQ, low cost for prototypes and small runs quantity.

1.3 PCB Specifications

1.4 Applications

Bluetooth Transmitter

HDMI Splitters

CCTV Systems

Led Street Lights

Low Noise Amplifier

Door Access Control System

5G Mobile Hotspot

Multicoupler

Embedded Systems Development

Smart Phone and Cell Phone

1.5 Gold finger PCB

The Purpose is to establish electrical connection to the board without using a two-part connector system. Plating of nickel and gold is carried out in essentially the same way as plating copper and tin/lead, i.e., by electrolytic deposition. Plating can be carried out either manually or automatically. In the manual process, boards are more or less stationary in the gold plating bath, which causes a varying gold deposition along the row of contact fingers. The result will frequently be a thickness distribution with the outermost contact fingers having perhaps twice as much deposited gold as the center contact fingers. In the automatic process, gold plating takes place while the boards slide through the plating cell. The method offers a gold thickness variation that can be controlled within ± 5% or better. This is because all contact fingers will be dealt with in exactly the same way when the board moves through the process cell.

Edge connectors are frequently provided with a slot that serves to guide the board with respect to the receptacle (locating slot) and/or to prevent incorrect insertion of the board (polarization slot). Usually, the PCB manufacturer prefers to route the slot simultaneously with the contouring of the board. Obviously, this requires that the slot be slightly wider than the router bit used.

In order to ease the insertion of the board into the receptacle, the edge along the connector should be bevelled. The bevelling also has the advantage of reducing the scraping of the contacts of the receptacle when the board is inserted in the receptacle.