Tel:
Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

Home ProductsFR-4 PCB Board

Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

  • Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
  • Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
  • Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
  • Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
  • Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-460-V4.53
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Base Material: FR-4 Min. Track/gap: 3mil / 3mil
Final Height Of PCB: 0.6mm ±0.1 Final Foil External: 1 Oz
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
 
1.1 General description
This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking. It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm are resin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.
 
1.2 Features and benefits
1. Via in pad design reduced the inductive reactance and capacitive reactance of the transmission line;
2. Immersion gold finish has high solderability, no stressing of circuit boards and less contamination of PCB surface;
3. Products and manufacturing are certified by authorized organizations;
4. Eligible products rate of first production: >95%;
5. Prototype PCB capability to volume production capability;
6. Delivery on time: >98%;
7. More than 18+ years of PCB experience;
8. IPC Class 2 / IPC Class 3;
 
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking 0
 
1.3 Applications
Led Lighting
Intercom System
Portable WiFi Router
GSM Tracker
Commercial Led Lighting
Modem WiFi 4G
Honeywell Access Control
Electronic Access Control
Audio Frequency Amplifier
File servers
 
1.4 PCB Specifications

PCB SIZE100 x 103mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers6 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP CS
4mil prepreg
copper ------- 18um(0.5oz) GND Plane
4mil FR-4
copper ------- 18um(0.5oz) PWR Plane
4mil prepreg
copper ------- 18um(0.5oz) PWR Plane
4mil FR-4
copper ------- 18um(0.5oz) SIG
4mil prepreg
copper ------- 18um(0.5oz) BOT PS
TECHNOLOGY 
Minimum Trace and Space:3mil/3mil
Minimum / Maximum Holes:0.22/3.50mm
Number of Different Holes:25
Number of Drill Holes:2315
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Controlno
BOARD MATERIAL 
Glass Epoxy:FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external:1oz
Final foil internal:0.5oz
Final height of PCB:0.6mm ±0.1
PLATING AND COATING 
Surface FinishImmersion gold 0.025µm over 3µm Nickel (14.4% area)
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Green, TAIYO PSR-2000 GT600D
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendNo silkscreen requried.
Colour of Component LegendNo silkscreen requried.
Manufacturer Name or Logo:No silkscreen requried.
VIAPlated through hole(PTH), Blind via and via capping on CS and PS, vias not be visible.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking 1
 
 
1.5 via in pad (VIP)
At present, the circuit board is becoming more and more dense and interconnected, and there is no more room for these wires and pads connecting the holes. Therefore, so in this context, the process of punching the holes on the pads arises at the historic moment. In brief, the via holes which have been plated through are plugged or filled by insulating resin through the method of screen leakage, and then drying, grinding, and then electroplating, so that the whole surface of the PCB is coated with copper, and no longer via holes can be seen.
 
The effect of via in pad is also very obvious: such as improved the electrical performance and reliability of electronic products, shorten the signal transmission wire, reduced the inductive reactance and capacitive reactance of the transmission line, and reduced internal and external electromagnetic interference.
 
Let’s see the basic process of via in pad.
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking 2
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking 3

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
Mobile Site Privacy PolicyChina metal core printed circuit board Supplier. Copyright © 2016 - 2022 circuitboardpcbs.com. All Rights Reserved. Developed by ECER