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RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-130-V1.0
Number Of Layers:
2
Glass Epoxy:
RO4003C LoPro
Final Foil:
1 Oz
Final Height Of PCB:
0.5 Mm ±10%
Surface Finish:
Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

 

 

 

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

  • Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4003C LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

  • Cellular base station antennas and power amplifiers
  • LNB’s for direct broadcast satellites
  • RF Identification Tags

 

Typical Properties of RO4003C LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        

 

 

 
 
 
RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers 0
 
products
PRODUCTS DETAILS
RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers
MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Western Union
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-130-V1.0
Number Of Layers:
2
Glass Epoxy:
RO4003C LoPro
Final Foil:
1 Oz
Final Height Of PCB:
0.5 Mm ±10%
Surface Finish:
Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 2.99-8.99 PER PIECE
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Western Union
Supply Ability:
45000 pieces per month
Product Description

RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

 

 

 

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

  • Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4003C LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

  • Cellular base station antennas and power amplifiers
  • LNB’s for direct broadcast satellites
  • RF Identification Tags

 

Typical Properties of RO4003C LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        

 

 

 
 
 
RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers 0
 
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