MOQ: | 1 |
Price: | USD 2.99-8.99 PER PIECE |
Standard Packaging: | Vacuum |
Delivery Period: | 10 working days |
Payment Method: | T/T, Western Union |
Supply Capacity: | 45000 pieces per month |
RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
CAF resistant
Our PCB Capability (RO4003C LoPro)
PCB Material: | Hydrocarbon Ceramic Laminates |
Designation: | RO4003C LoPro |
Dielectric constant: | 3.38±0.05 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
Typical Properties of RO4003C LoPro
Property | Typical Value | Direction | Units | Condition | Test Method |
Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
14 | y | ||||
46 | z | ||||
Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | °C TGA | ASTM D3850 | ||
Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-Free Process Compatible | Yes |
MOQ: | 1 |
Price: | USD 2.99-8.99 PER PIECE |
Standard Packaging: | Vacuum |
Delivery Period: | 10 working days |
Payment Method: | T/T, Western Union |
Supply Capacity: | 45000 pieces per month |
RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
CAF resistant
Our PCB Capability (RO4003C LoPro)
PCB Material: | Hydrocarbon Ceramic Laminates |
Designation: | RO4003C LoPro |
Dielectric constant: | 3.38±0.05 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
Typical Properties of RO4003C LoPro
Property | Typical Value | Direction | Units | Condition | Test Method |
Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
14 | y | ||||
46 | z | ||||
Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | °C TGA | ASTM D3850 | ||
Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-Free Process Compatible | Yes |